Preface | p. xiii |
Fabrication | |
Introduction | p. 3 |
What are MEMS? | p. 3 |
Why MEMS? | p. 4 |
Low cost, redundancy and disposability | p. 4 |
Favorable scalings | p. 5 |
How are MEMS made? | p. 8 |
Roadmap and perspective | p. 12 |
Essay: The Role of Surface to Volume Atoms as Magnetic Devices Miniaturize | p. 12 |
The substrate and adding material to it | p. 17 |
Introduction | p. 17 |
The silicon substrate | p. 17 |
Silicon growth | p. 17 |
It's a crystal | p. 19 |
Miller indices | p. 20 |
It's a semiconductor | p. 24 |
Additive technique: Oxidation | p. 35 |
Growing an oxide layer | p. 35 |
Oxidation kinetics | p. 37 |
Additive technique: Physical vapor deposition | p. 40 |
Vacuum fundamentals | p. 41 |
Thermal evaporation | p. 46 |
Sputtering | p. 51 |
Other additive techniques | p. 57 |
Chemical vapor deposition | p. 57 |
Electrodeposition | p. 58 |
Spin casting | p. 58 |
Wafer bonding | p. 58 |
Essay: Silicon Ingot Manufacturing | p. 59 |
Creating and transferring patterns-Photolithography | p. 65 |
Introduction | p. 65 |
Keeping it clean | p. 66 |
Photoresist | p. 69 |
Positive resist | p. 69 |
Negative resist | p. 70 |
Working with resist | p. 71 |
Applying photoresist | p. 71 |
Exposure and pattern transfer | p. 72 |
Development and post-treatment | p. 77 |
Masks | p. 79 |
Resolution | p. 81 |
Resolution in contact and proximity printing | p. 81 |
Resolution in projection printing | p. 82 |
Sensitivity and resist profiles | p. 84 |
Modeling of resist profiles | p. 86 |
Photolithography resolution enhancement technology | p. 87 |
Mask alignment | p. 88 |
Permanent resists | p. 89 |
Essay: Photolithography-Past, Present and Future | p. 90 |
Creating structures-Micromachining | p. 95 |
Introduction | p. 95 |
Bulk micromachining processes | p. 96 |
Wet chemical etching | p. 96 |
Dry etching | p. 106 |
Surface micromachining | p. 108 |
Surface micromachining processes | p. 109 |
Problems with surface micromachining | p. 111 |
Lift-off | p. 112 |
Process integration | p. 113 |
A surface micromachining example | p. 115 |
Designing a good MEMS process flow | p. 119 |
Last thoughts | p. 124 |
Essay: Introduction to MEMS Packaging | p. 126 |
Solid mechanics | p. 131 |
Introduction | p. 131 |
Fundamentals of solid mechanics | p. 131 |
Stress | p. 132 |
Strain | p. 133 |
Elasticity | p. 135 |
Special cases | p. 138 |
Non-isotropic materials | p. 139 |
Thermal strain | p. 141 |
Properties of thin films | p. 142 |
Adhesion | p. 142 |
Stress in thin films | p. 142 |
Peel forces | p. 149 |
Applications | |
Thinking about modeling | p. 157 |
What is modeling? | p. 157 |
Units | p. 158 |
The input-output concept | p. 159 |
Physical variables and notation | p. 162 |
Preface to the modeling chapters | p. 163 |
MEMS transducers-An overview of how they work | p. 167 |
What is a transducer? | p. 167 |
Distinguishing between sensors and actuators | p. 168 |
Response characteristics of transducers | p. 171 |
Static response characteristics | p. 172 |
Dynamic performance characteristics | p. 173 |
MEMS sensors: principles of operation | p. 178 |
Resistive sensing | p. 178 |
Capacitive sensing | p. 181 |
Piezoelectric sensing | p. 182 |
Resonant sensing | p. 184 |
Thermoelectric sensing | p. 186 |
Magnetic sensing | p. 189 |
MEMS actuators: principles of operation | p. 193 |
Capacitive actuation | p. 193 |
Piezoelectric actuation | p. 194 |
Thermo-mechanical actuation | p. 196 |
Thermo-electric cooling | p. 201 |
Magnetic actuation | p. 202 |
Signal conditioning | p. 204 |
A quick look at two applications | p. 206 |
RF applications | p. 207 |
Optical applications | p. 207 |
Piezoresistive transducers | p. 211 |
Introduction | p. 211 |
Modeling piezoresistive transducers | p. 212 |
Bridge analysis | p. 213 |
Relating electrical resistance to mechanical strain | p. 215 |
Device case study: Piezoresistive pressure sensor | p. 221 |
Capacitive transducers | p. 231 |
Introduction | p. 231 |
Capacitor fundamentals | p. 232 |
Fixed-capacitance capacitor | p. 232 |
Variable-capacitance capacitor | p. 234 |
An overview of capacitive sensors and actuators | p. 236 |
Modeling a capacitive sensor | p. 239 |
Capacitive half-bridge | p. 239 |
Conditioning the signal from the half-bridge | p. 243 |
Mechanical subsystem | p. 246 |
Device case study: Capacitive accelerometer | p. 250 |
Piezoelectric transducers | p. 255 |
Introduction | p. 255 |
Modeling piezoelectric materials | p. 256 |
Mechanical modeling of beams and plates | p. 261 |
Distributed parameter modeling | p. 261 |
Statics | p. 262 |
Bending in beams | p. 268 |
Bending in plates | p. 274 |
Case study: Cantilever piezoelectric actuator | p. 276 |
Thermal transducers | p. 283 |
Introduction | p. 283 |
Basic heat transfer | p. 284 |
Conduction | p. 286 |
Convection | p. 288 |
Radiation | p. 289 |
Case study: Hot-arm actuator | p. 294 |
Lumped element model | p. 295 |
Distributed parameter model | p. 300 |
FEA model | p. 306 |
Essay: Effect of Scale on Thermal Properties | p. 310 |
Introduction to microfluidics | p. 317 |
Introduction | p. 317 |
Basics of fluid mechanics | p. 319 |
Viscosity and flow regimes | p. 320 |
Entrance lengths | p. 324 |
Basic equations of fluid mechanics | p. 325 |
Conservation of mass | p. 325 |
Conservation of linear momentum | p. 326 |
Conservation equations at a point: Continuity and Navier-Stokes equations | p. 329 |
Some solutions to the Navier-Stokes equations | p. 337 |
Couette flow | p. 337 |
Poiseuille flow | p. 339 |
Electro-osmotic flow | p. 339 |
Electrostatics | p. 340 |
Ionic double layers | p. 346 |
Navier-Stokes with a constant electric field | p. 355 |
Electrophoretic separation | p. 357 |
Essay: Detection Schemes Employed in Microfluidic Devices for Chemical Analysis | p. 362 |
Microfabrication laboratories | |
Microfabrication laboratories | p. 371 |
Hot-arm actuator as a hands-on case study | p. 371 |
Overview of fabrication of hot-arm actuators | p. 372 |
Cleanroom safety and etiquette | p. 375 |
Experiments | p. 377 |
Wet oxidation of a silicon wafer | p. 377 |
Photolithography of sacrificial layer | p. 384 |
Depositing metal contacts with evaporation | p. 388 |
Wet chemical etching of aluminum | p. 392 |
Plasma ash release | p. 395 |
Characterization of hot-arm actuators | p. 397 |
Notation | p. 405 |
Periodic table of the elements | p. 411 |
The complimentary error function | p. 413 |
Color chart for thermally grown silicon dioxide | p. 415 |
Glossary | p. 417 |
Subject Index | p. 439 |
Table of Contents provided by Ingram. All Rights Reserved. |
The New copy of this book will include any supplemental materials advertised. Please check the title of the book to determine if it should include any access cards, study guides, lab manuals, CDs, etc.
The Used, Rental and eBook copies of this book are not guaranteed to include any supplemental materials. Typically, only the book itself is included. This is true even if the title states it includes any access cards, study guides, lab manuals, CDs, etc.