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9780130113801

Low-Voltage Low-Power Digital Bicmos Circuits: Circuit Design, Comparative Study, and Sensitivity Analysis

by ; ; ;
  • ISBN13:

    9780130113801

  • ISBN10:

    0130113808

  • Format: Hardcover
  • Copyright: 1999-07-01
  • Publisher: PRENTICE HALL
  • Purchase Benefits
List Price: $80.00

Summary

PLEASE PROVIDE COURSE INFORMATION PLEASE PROVIDE

Table of Contents

Preface ix
Acknowledgments xi
Nomenclature xiii
Introduction
1(26)
Why Low-Voltage, Low-Power?
2(2)
Why BiCMOS Technology?
4(3)
Applications of BiCMOS
7(3)
Random Access Memories (RAMs)
7(2)
Digital Signal Processing (DSP)
9(1)
Telecommunications Applications
9(1)
Low-Voltage Low-Power Design
10(11)
Low-Voltage Low-Power Design Limitations
10(3)
Power Dissipation of a Single Logic Gate
13(1)
Power Dissipation of LSIs
14(1)
Techniques of Reducing the Power Dissipation
15(2)
Future BiCMOS Directions
17(4)
Conclusions
21(1)
References
21(6)
BiCMOS Process Technology
27(56)
Introduction
27(1)
Bipolar and CMOS Processes Convergence
28(2)
CMOS Processing Issues of the Twin-Well BiCMOS Process
30(3)
Various Source/Drain Structures and the Channel Profiles
30(3)
Threshold Voltage Issues
33(1)
Bipolar Process Techniques
33(6)
Base Design Techniques
36(1)
Collector Design Techniques
37(1)
Emitter Design Techniques
38(1)
BiCMOS Isolation Issues
39(5)
Latch-up Phenomenon
39(1)
Trench Isolation
40(2)
Epitaxial Layer
42(1)
Buried Layers
43(1)
Active Device Isolation
43(1)
BiCMOS Interconnect Issues
44(6)
Silicidation
44(2)
Local Interconnect
46(2)
Metallization and Planarization
48(2)
Classification of BiCMOS Technologies
50(15)
Process Flow of a High-Performance 5 V, 0.8 μm Digital BiCMOS
50(6)
Process Changes for the 0.5 μm Digital BiCMOS Technology
56(4)
An Analog/Digital BiCMOS Process Flow
60(5)
A New Low-Power Ultra Low-Capacitance BiCMOS Process
65(3)
Process Description
66(1)
Shallow Trench Isolation (STI)
66(2)
Manufacturing Considerations
68(1)
Future Trends in BiCMOS Technology
68(5)
Bipolar Device Structure Improvements
69(3)
Silicon-On-Insulator (SOI) Technology
72(1)
Conclusions
73(2)
References
75(8)
MOS Device Modeling
83(48)
The Threshold Voltage Models
83(4)
The MOSFET Current Models
87(9)
The MOSFET in a Hybrid Mode Environment
96(28)
Surface P-Channel for Sub-Half Micron Devices
97(3)
Device Fabrication
100(1)
Model Parameters Extraction
100(2)
Sub-Half Micron DC Model Formulation
102(22)
Concluding Remarks
124(1)
Summary
125(1)
References
126(5)
Low-Voltage BiCMOS Digital Circuits
131(180)
Introduction
131(1)
Source-Well Tie and Quasi-Reduction of Bipolar Turn-On Voltage Techniques
132(8)
pMOS/NPN Pull-Down Technique With and Without Source-Well Tie
132(4)
Quasi-Reduction of Bipolar Turn-On Voltage Technique
136(4)
Full-Swing BiCMOS Logic Circuits with Complementary Emitter-Follower Driver Configuration
140(26)
Introduction
140(7)
BiCMOS Driver Configurations
147(2)
Full-Swing Techniques
149(1)
Comparison Between the Three Different Driver Configurations
150(3)
Full-Swing Complementary MOS/Bipolar Logic (FS-CMBL) Circuits
153(2)
Experimental Results and Analysis
155(1)
Circuit Variations of the FS-CMBL with Feedback
156(4)
Experimental Results and Analysis
160(6)
Merged BiCMOS (MBiCMOS) Logic Gates
166(11)
Introduction
166(1)
MBiCMOS Gate
167(2)
Circuit Performance and Comparison
169(3)
Experimental Tests and Analysis
172(3)
Simulation Results and Analysis
175(2)
Full-Swing MBiCMOS Gate
177(1)
Full Voltage Swing Multi-Drain/Multi-Collector Complementary BiCMOS Buffers
177(12)
Introduction
177(1)
Conventional BiCMOS and CBiCMOS Buffers
178(1)
Multi-Drain/Multi-Collector BiCMOS Buffers
179(2)
Simulation Results and Discussion
181(2)
Full-Swing Multi-Drain/Multi-Collector BiCMOS Buffers
183(1)
Circuit Implementation and Operation
184(1)
Simulation Results and Discussion
185(4)
Quasi-Complementary BiCMOS Logic Circuits
189(19)
Introduction
189(1)
Circuit Concept of the QC-BiCMOS and Its Advantages
190(3)
Circuit Performance Comparison and Analysis
193(8)
Delay Analysis
201(3)
Design Issues
204(1)
Experimental Results
204(2)
Appendix
206(2)
Full-Swing Schottky BiCMOS/BiNMOS Logic Circuits
208(15)
Introduction
208(1)
Basic Concept
208(2)
Circuit Implementations
210(2)
Circuit Simulation and Discussion
212(5)
Scaling the Supply Voltage
217(1)
Delay Dependence on the Frequency of Operation
218(1)
Power Dissipation
219(2)
Area Comparison
221(1)
Crossover Capacitance
222(1)
Feedback-Type BiCMOS Logic Circuits
223(35)
Introduction
223(1)
Conventional BiCMOS Circuits and Their Limitations
223(1)
R + N Type and Feedback-Type (FB) BiCMOS Logic Gates
224(6)
BiCMOS Full-Swing Circuits Utilizing a Positive Capacitively Coupled Feedback Technique
230(14)
1.2 V Complementary Feedback BiCMOS Logic Gates
244(8)
1.5 V BiCMOS Dynamic Logic Circuit
252(6)
High-Beta BiCMOS (Hβ-BiCMOS) Logic Circuits
258(11)
Introduction
258(1)
Hβ-BiCMOS Logic Circuit
258(3)
Circuit Operation of the Hβ-BiCMOS Circuit
261(1)
Circuit Simulations and Discussion
262(2)
A BiCMOS Charge Pump with Hβ-BiCMOS
264(5)
Transiently Saturated Full-Swing BiCMOS (TS-FS-BiCMOS) Logic Circuits
269(10)
Introduction
269(1)
Circuit Concept and Operation
269(3)
Circuit Performance Comparison and Analysis
272(4)
Design Issues
276(2)
Experimental Results and Analysis
278(1)
Bootstrapped BiCMOS Logic Circuits
279(26)
Introduction
279(2)
1.5 V Bootstrapped BiCMOS Logic Gate (BS-BiCMOS)
281(2)
Bootstrapped Full-Swing BiCMOS/BiNMOS Inverter
283(14)
Double Bootstrapped BiCMOS Logic Gates (DB-BiCMOS)
297(8)
References
305(6)
Delay Time and Power Dissipation Sensitivity Analyses of Multi-Generation BiCMOS Digital Circuits
311(32)
Introduction
311(1)
Relationship Between Key BJT/MOS Process and Device/Circuit Parameters
312(1)
Sensitivity Analysis of the Conventional BiCMOS Circuit
313(13)
Delay Time Sensitivity to Key Device Parameters
313(4)
The Effects of the Load Capacitance on the Circuit Delay Sensitivity
317(2)
The Effects of the Quality of the BJT on the Circuit Delay Sensitivity
319(1)
The Effects of Scaling the Technology on the Circuit Delay Sensitivity
320(2)
HSPICE Simulations and Analysis
322(4)
Sensitivity Evaluation and Comparison of Low-Voltage, Low-Power BiCMOS Circuits
326(12)
The Effects of Loading on the Delay and Power Dissipation Sensitivities
331(5)
The Effects of the Quality of the BJT on the Delay and Power Dissipation Sensitivities
336(2)
The Effects of Scaling the Technology on the Delay and Power Dissipation Sensitivities
338(1)
Delay Sensitivity Upper and Lower Bounds: A Worst Case Scenario
338(1)
Conclusions
339(2)
References
341(1)
Appendix
342(1)
The Authors 343(2)
Index 345

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