Materials Science of Microelectromechanical Systems (Mems) Devices: Symposium Held December 1-2, 1998, Boston, Massachusetts, U.S.A/

by Heuer, A. H.; Jacobs, S. Joshua

• ISBN13: 9781558994522
• ISBN10: 1558994521
• Format: Hardcover
• Copyright: 2000-02-01
• Publisher: Materials Research Society

Table of Contents

Preface	ix
Materials Research Society Symposium Proceedings	x
*Recent Developments in Experimental and Theoretical Studies of the Mechanical Behavior of Polycrystalline Silicon for Microelectromechanical Systems	3	(12)
R. Ballarini
Influence of Specimen Size and Sub-Micron Notch on the Fracture Behavior of Single Crystal Silicon Microelements and Nanoscopic AFM Damage Evaluation	15	(6)
K. Minoshima
S. Inoue
T. Terada
K. Komai
Dependence of Silicon Fracture Strength and Surface Morphology on Deep Reactive lon Etching Parameters	21	(6)
K-S. Chen
A.A. Ayon
K.A. Lohner
M.A. Kepets
K. Melconian
S.M. Spearing
Rapid Thermal Annealing for Residual-Stress Relaxation in Undoped or Doped Polysilicon Thin Films	27	(6)
X. Zhang
T-Y. Zhang
Y. Zohar
Stress-Caused Deflections of Asymmetrical Coated Single-Crystal Silicon Elements	33	(6)
M. Kuechler
K. Griesbach
A. Bertz
T. Gessner
W. Faust
R. Dudek
Determining the High-Temperature Properties of Thin Films Using Bilayered Cantilevers	39	(6)
H. Tada
P. Nieva
P. Zavracky
I.N. Miaoulis
P.Y. Wong
Thin Film Stress Measurement With a Tunneling Sensor	45	(6)
P. Zhang
R.P. Vinci
J.C. Bravman
T.W. Kenny
*Deep Reactive lon Etching of Silicon	51	(12)
A.A. Ayon
K-S. Chen
K.A. Lohner
S.M. Spearing
H.H. Sawin
M.A. Schmidt
The Benefits of Process Parameter Ramping During the Plasma Etching of High Aspect Ratio Silicon Structures	63	(6)
J. Hopkins
H. Ashraf
J.K. Bhardwaj
A.M. Hynes
I. Johnston
J.N. Shepherd
Etch Selectivity of Novel Epitaxial Layers for Bulk Micromachining	69	(6)
J.T. Borenstein
N.D. Gerrish
M.T. Currie
E.A. Fitzgerald
Silicon Electromachining Processes in Aqueous Solutions	75	(6)
M. Kovler
D. Starosvetsky
Y. Nemirovsky
J. Yahalom
Laser Machining With Ultrashort Pulses: Effects of Pulse-Width, Frequency and Energy	81	(4)
D.E. Bliss
D.P. Adams
S.M. Cameron
T.S. Luk
Microfabricated Silicon Carbide Microengine Structures	85	(6)
K.A. Lohner
K-S. Chen
A.A. Ayon
S.M. Spearing
SiC Thin Film Characterization and Stress Measurements for High-Temperature Sensors Applications	91	(6)
C. Gourbeyre
P. Aboughe-nze
C. Malhaire
M. Le Berre
Y. Monteil
D. Barbier
Mechanical and Thermophysical Properties of Silicon Nitride Thin Films at High Temperatures Using In Situ Mems Temperature Sensors	97	(6)
P. Nieva
H. Tada
P. Zavracky
G. Adams
I. Miaoulis
P. Wong
Extraction of the Coefficient of Thermal Expansion of Thin Films From Buckled Membranes	103	(6)
V. Ziebart
O. Paul
H. Baltes
Diamond and Polycrystalline Diamond for MEMS Applications: Simulations and Experiments	109	(6)
T. Cagin
J. Che
M. N. Gardos
W.A. Goddard III
Performance of Ultrahard Carbon Wear Coatings on Microgears Fabricated by LIGA	115	(6)
J.W. Ager III
O.R. Monteiro
I.G. Brown
D.M. Follstaedt
J.A. Knapp
M.T. Dugger
T.R. Christenson
Understanding and Tailoring the Mechanical Properties of LIGA Fabricated Materials	121	(6)
T.E. Buchheit
T.R. Christenson
D.T. Schmale
D.A. Lavan
Torsion Testing of Diffusion Bonded LIGA Formed Nickel	127	(6)
T.R. Christenson
T.E. Buchheit
D.T. Schmale
Micro-Tensile and Fatigue Testing of Copper Thin Films on Substrates	133	(6)
M. Hommel
O. Kraft
S.P. Baker
E. Arzt
Conformal Electroless Copper and Nickel Deposition on MEMS Structures	139	(6)
H.P. Neves
T.D. Kudrle
J-M. Chen
S.G. Adams
M. Maharbiz
S. Lopatin
N.C. MacDonald
*Shape Memory and Magnetostrictive Materials for MEMS	145	(8)
M. Wuttig
E. Quandt
A. Ludwig
B. Winzek
Reliability and Properties of PZT Thin Films for MEMS Applications	153	(6)
D.F. Bahr
J.C. Merlino
P. Banerjee
C.M. Yip
A. Bandyopadhyay
Dry Etching of Sol-Gel PZT	159	(6)
R. Zeto
B. Rod
M. Dubey
M. Ervin
J. Conrad
R. Piekarz
S. Trolier-McKinstry
T. Su
J. Shepard
DC Magnetron Reactive Sputtering of Low Stress AIN Piezoelectric Thin Films for MEMS Application	165	(6)
P. Hsieh
R. Reif
B. Cunningham
Sol-Gel Casting of Ceramic Microcomponents	171	(6)
C.M. Chan
G.Z. Cao
Meso-Scale Pressure Transducers Utilizing Low Temperature Co-Fired Ceramic Tapes	177	(6)
H. Lynch
J. Park
P.A. Espinoza-Valejos
J.J. Santiago-Aviles
L.Sola-Laguna
Microstructural Evolution of Co-Fired Ceramic Tapes for MEMS Applications	183	(6)
S. Charoenmechaikul
D.E. Luzzi
A Direct Molding Technique to Fabricate Silica Micro-Optical Components	189	(6)
C-K.T. Lee
M.J. Vasile
J. Goettert
Fabrication of MEMS Devices by Powder-Filling Into DXRL-Formed Molds	195	(6)
T.J. Garino
T. Christenson
E. Venturini
Micrometer-Scale Machining of Metals and Polymers Enabled by Focused lon Beam Sputtering	201	(6)
D.P. Adams
G.L. Benavides
M.J. Vasile
Circuit Pattern Cu Deposition on Polyimide Surface Using ArF Excimer Laser	207	(6)
M. Tomita
M. Murahara
Mechanical Properties of SU-8	213	(6)
A. McAleavey
G. Coles
R.L. Edwards
W.N. Sharpe, Jr.
Fullerene Derivatives as Novel Resist Materials for Fabrication of MEMS Devices by Electron Beam Lithography	219	(6)
A.P.G. Robinson
R.E. Palmer
T. Tada
T. Kanayama
E.J. Shelley
J.A. Preece
A Novel Range of Noble Metal Organometallic Fluorides for Use in the Fabrication of Submicron Metal Features by E-Beam or UV Irradiation	225	(6)
J. Thomson
A.H. Fzea
J. Lobban
P. McGivern
J.A. Cairns
A.G. Fitzgerald
G.J. Berry
M.R. Davidson
Y.C. Fan
The Synthesis of Novel Polynuclear Organogold Complexes	231	(6)
J. Thomson
A.H. Fzea
J. Lobban
P.G. McGivern
J.A. Cairns
A.G. Fitzgerald
G.J. Berry
M.R. Davidson
Y.C. Fan
Surface Dipoles Influence the Wettability of Terminally Fluorinated Organic Films	237	(6)
R. Colorado, Jr.
M. Graupe
M. Takenaga
T. Koini
T.R. Lee
Author Index	243	(2)
Subject Index	245