Materials Science of Microelectromechanical Systems Mems Devices III

by Kahn, Harold G.; Judy, M.; Spearing, S. M.; Deboer, M. P.

• ISBN13: 9781558995673
• ISBN10: 1558995676
• Format: Hardcover
• Copyright: 2001-07-01
• Publisher: Materials Research Society

Summary

Microelectromechanical systems (MEMS) is a growing field with numerous potential commercial applications, including pressure and inertial sensing, optical and electrical switching, power conversion, fluidic flow control, and chemical analysis. MEMS combine mechanical and electrical (and sometimes optical, chemical, or biological) function at small scales using many of the batch fabrication techniques developed for the micro-electronics industry. New materials have been developed or adapted for MEMS applications for use as structures, actuators, and sensors. New processing techniques also have been established for integrating these materials with existing MEMS. In addition, MEMS technology has proven ideal for allowing the mechanical and tribological characterization of materials at small scales. This book addresses these issues and a variety of materials are discussed, including Si, porous Si, SiC, SiGe, diamond, electroplated Ni and Cu, as well as piezoelectric, ferroelectric, and shape memory materials, and self-assembled organic monolayers. Fabrication processes include plasma and chemical etching, Si bonding, high-aspect-ratio lithography and micromolding. In addition, the stress, fracture strength, fatigue, and friction of MEMS materials and structures are also discussed.

Table of Contents

Preface	p. xi
Materials Research Society Symposium Proceedings	p. xii
Metrology
Temperature-Dependent Internal Friction in Silicon Nanoelectromechanical Systems	p. EE1.3
Resonating Microelectromechanical Structures for Metrology	p. EE1.4
Mechanical Properties
On the Fracture Toughness of Polysilicon MEMS Structures	p. EE2.1
The Influence of Fabrication Governed Surface Conditions on the Mechanical Strength of Thin Film Materials	p. EE2.2
On the Evolution of Surface Morphology of Polysilicon MEMS Structures During Fatigue	p. EE2.3
Anelastic Creep Phenomena in Thin Metal Plated Cantilevers for MEMS	p. EE2.5
Tribology
Novel Chemistry for Surface Engineering in MEMS	p. EE3.3
Electro-Deposited Metals and PZT
Elastic and Inelastic Properties of Electroplated Nickel Used in LIGA Techniques	p. EE4.1
Structural and Micromechanical Assessment of Electrochemically Grown Metal Layers for Si Magnetic Microactuators	p. EE4.2
Defects and Failure Modes in PZT Films for a MEMS Microengine	p. EE4.4
Dielectric and Pulsed Spectroscopy of Shear Mode PZT Microactuator	p. EE4.6
Poster Session
Multilayer Materials for Electrostatic Switches	p. EE5.1
Optical Manipulation of Inorganic and Organic Objects in Soft Microfluidic Devices	p. EE5.2
Adjustment of Membrane Stress Using Aluminum Oxide and Silicon Dioxide Multi Layer Structure	p. EE5.3
Young's Modulus and Fracture Strength of Three Polysilicons	p. EE5.5
High-Cycle Fatigue of Polycrystalline Silicon Thin Films in Laboratory Air	p. EE5.8
Finite Element Analysis of the Precracked Line Scratch Test	p. EE5.9
Deformation Mechanisms of a Micro-Sized Austenitic Stainless Steel With Fine Grains	p. EE5.10
Corrosion Fatigue Tests of Micro-Sized Specimens	p. EE5.11
Anisotropic Fracture Behavior of Electroless Deposited Ni-P Amorphous Alloy Thin Films	p. EE5.12
Temperature and Doping Dependency of Piezoresistivity in P-Type Silicon	p. EE5.13
Curvature Model for an Ion-Machined Free-Standing Thin Film MEMS Device	p. EE5.14
Nanoindentation of Microspring Thin Films	p. EE5.15
Effect of La on the Growth of Cu[subscript 6]Sn[subscript 5] Intermetallic Compound for Improved Sn-Pb Solder Joints	p. EE5.18
Measurements of Residual Stress in the Layers of Thin Film Micro-Gas Sensors	p. EE5.19
Control of Stress With Growth Conditions and Mechanical Parameters Determination of 3C-SiC Heteroepitaxial Thin Films	p. EE5.20
Double Sided Porous Silicon on Patterned Substrates for Thermal Effect Microsystems	p. EE5.21
On the Role of the Underlying Microstructure on the Mechanical Properties of Microelectromechanical Systems (MEMS) Materials	p. EE5.22
Annealing Effects on the Microstructure and Mechanical Properties of LIGA Nickel for MEMS	p. EE5.23
Unstable Etching of Si(110) With Potassium Hydroxide	p. EE5.27
Simple and Low Cost Patterning Process for Sputtered Pb(Zr,Ti)O[subscript 3] Thin Films and Electrodes for Membrane-Based Microsystems Applications	p. EE5.29
Microfabrication of Crevice Corrosion Samples	p. EE5.31
Etch Rate and Surface Morphology of Plasma Etched Glass Substrates	p. EE5.32
Fabrication of MEMS Components Based on Ultrananocrystalline Diamond Thin Films and Characterization of Mechanical Properties	p. EE5.33
Asymmetrical Polysilicon Electrothermal Microactuators for Achieving Large In-Plane Mechanical Forces and Deflections	p. EE5.34
Issues in the Flexible Integration of Sputter-Deposited PZT Thin Films With Polysilicon and Ti/Pt Electrode Layers for Use as Sensors and Actuators in Microelectromechanical Systems (MEMS)	p. EE5.35
Measurement of Electrical Charge During Nanoindentation of Ferroelectric Thin Films	p. EE5.37
Wet-Etch Patterning of Lead Zirconate Titanate (PZT) Thick Films for Microelectromechanical Systems (MEMS) Applications	p. EE5.39
Packaging
Challenges in DMD Assembly and Test	p. EE6.1
Characterization of Silicon Fusion Bonds Using a Four-Point Bend Specimen	p. EE6.3
Phenomenological Model of Non-Evaporated Getter for Microelectromechanical Systems (MEMS) Applications	p. EE6.4
High Temperature, High-Pressure Fluid Connections for Power Micro-Systems	p. EE6.5
New Materials
Developing a New Material for MEMS: Amorphous Diamond	p. EE7.1
Preparation of Mesoporous Oxides for MEMS Structures	p. EE7.3
Silicon Germanium Epitaxy: A New Material for MEMS	p. EE7.4
Optical Microsystems and Processing Techniques I
The Characterization of TiNi Shape-Memory Actuated Microvalves	p. EE8.3
Processing of Thick Dielectric Films for Power MEMS: Stress and Fracture	p. EE8.4
Microbridge Testing of Silicon Oxide/Silicon Nitride Bilayer Films	p. EE8.5
Processing Techniques II
Low Temperature Si Direct Bonding by Plasma Activation	p. EE9.2
MEMS Materials and Fabrication Technology on Large Areas: The Example of an X-ray Imager	p. EE9.3
Micropatterning of Ceramics on Substrates Towards Gas Sensing Applications	p. EE9.4
The Mechanical Properties of Polycrystalline Silicon Carbide Films Determined Using Bulk Micromachined Diaphragms	p. EE9.5
Author Index
Subject Index
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