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9783527406500

Metal Based Thin Films for Electronics

by ;
  • ISBN13:

    9783527406500

  • ISBN10:

    3527406506

  • Edition: 2nd
  • Format: Hardcover
  • Copyright: 2006-07-21
  • Publisher: Wiley-VCH

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Summary

This up-to-date handbook covers the main topics of preparation, characterization and properties of complex metal-based layer systems. The authors -- an outstanding group of researchers -- discuss advanced methods for structure, chemical and electronic state characterization with reference to the properties of thin functional layers, such as metallization and barrier layers for microelectronics, magnetoresistive layers for GMR and TMR, sensor and resistance layers. As such, the book addresses materials specialists in industry, especially in microelectronics, as well as scientists, and can also be recommended for advanced studies in materials science, analytics, surface and solid state science.

Author Biography

Klaus Wetzig studied physics at the University of Technology in Dresden, receiving his licence in 1963, his doctorate in 1967 and his habilitation in 1973. In 1975 he moved to the Academy of Sciences, and since 1992 he is Full Professor of Materials Analysis at the University of Technology in Dresden and Director at the Leibniz Institute of Solid State and Materials Research Dresden. His research interests include materials analysis and microstructures, especially electron microscopy of functional materials, characterization of thin films for electronics, and nanostructural features in general.

Claus Michael Schneider studied physics at the RWTH Aachen University receiving his diploma in 1985. He obtained his PhD in 1990 at the Free University of Berlin and his habilitation in 1996 at the Martin-Luther University Halle-Wittenberg. From 1998 to 2003 he headed the Department of thin Film Systems and Nanostructures at the Leibniz Institute of Solid State and Materials research Dresden. Since June 2003 he directs the Institute "Electronic Properties" within the department of Solid State Research(IFF) at the Forschungzentrum Julich, being jointly appointed as full professor at the University Duisburg-Essen. His research interests include solid state physics, thin film systems, surface magnetism and spintronics as well as the physics of nanostructures.

Table of Contents

Preface XI
List of Contributors XIII
1 Introduction 1(6)
Klaus Wetzig, Claus M. Schneider
1.1 Prologue
1(1)
1.2 Organization, Aim and Content of This Book
2(5)
2 Thin Film Systems: Basic Aspects 7(134)
2.1 Interconnects for Microelectronics
7(21)
Ralph Spolenak, Ehrenfried Zschech
2.1.1 Introduction
7(1)
2.1.2 Metallization Layers
8(4)
2.1.3 Materials Science of Metallic Interconnects
12(14)
2.1.4 Function of Barrier and Nucleation Layers and Materials Selection
26(2)
2.2 Metallization Structures in Acoustoelectronics
28(20)
Manfred Weihnacht
2.2.1 Introduction
28(2)
2.2.2 Fundamentals of Surface Acoustic Waves
30(10)
2.2.3 Interdigital Transducers (IDTs)
40(4)
2.2.4 Reflector Gratings
44(1)
2.2.5 Waveguides, Energy Trapping
44(1)
2.2.6 Multistrip Couplers
45(1)
2.2.7 Interdigital Transducers with Piezoelectric Layer
45(2)
2.2.8 Metal Strips with Dielectric Coatings
47(1)
2.3 Silicide Layers for Electronics
48(23)
Joachim Schumann
2.3.1 Introduction
48(1)
2.3.2 The Basic Chemical and Physical Properties
49(6)
2.3.3 Preparation of Silicides
55(7)
2.3.4 Silicides with Metallic Conductivity
62(2)
2.3.5 Semiconducting Silicides
64(4)
2.3.6 Heterogeneously Disordered Silicide Films
68(3)
2.4 Complex Layered Systems for Magnetoelectronics
71(32)
Claus M. Schneider
2.4.1 Introduction
71(2)
2.4.2 Magnetism: A Primer
73(1)
2.4.3 Magnetic Coupling Phenomena
74(8)
2.4.4 Electric Transport in Layered Magnetic Systems
82(11)
2.4.5 Functional Thin Film Systems
93(10)
2.5 Multilayer and Single-Surface Reflectors for X-Ray Optics
103(19)
Hermann Mai, Stefan Braun
2.5.1 Introduction
103(2)
2.5.2 Refraction and Reflection at Single Boundaries
105(4)
2.5.3 Bragg Reflection at 1D Lattice Systems
109(10)
2.5.4 Multilayer Preparation
119(3)
2.6 Metallic Layers for Photovoltaics
122(7)
Winfried Blau
2.6.1 Introduction
122(1)
2.6.2 Solar Cells
123(1)
2.6.3 Functionalities of Thin Metallic Films in PV Cells
124(5)
2.6.4 Examples
129(1)
2.7 References
129(12)
3 Thin Film Preparation and Characterization Techniques 141(90)
3.1 Thin Film Preparation Methods
141(19)
Christian Wenzel
3.1.1 Introduction
141(2)
3.1.2 Physical Vapor Deposition
143(10)
3.1.3 Chemical Vapor Deposition
153(3)
3.1.4 Non Vacuum-Based Deposition
156(4)
3.1.5 Outlook
160(1)
3.2 Electron Microscopy and Diffraction
160(19)
Klaus Wetzig, Jürgen Thomas
3.2.1 Transmission Electron Microscopy (TEM)-Imaging
160(8)
3.2.2 TEM-Selected Area Electron Diffraction
168(4)
3.2.3 In situ-SEM Methods
172(5)
3.2.4 Electron Backscatter Diffraction
177(2)
3.3 X-Ray Scattering Techniques
179(18)
Michael Hecker
3.3.1 Wide Angle Diffraction
180(10)
3.3.2 Reflectometry
190(4)
3.3.3 Soft X-Rays and Magnetic Scattering
194(3)
3.4 Spectroscopic Techniques
197(17)
Klaus Wetzig
3.4.1 Element Distribution Analysis
197(10)
3.4.2 Element Depth Profile Analysis
207(7)
3.5 Stress Measurement Techniques
214(11)
Winfried Brückner
3.5.1 Stress and Strain
214(3)
3.5.2 Substrate Curvature
217(2)
3.5.3 Measurement Techniques
219(6)
3.6 References
225(6)
4 Challenges for Thin Film Systems Characterization and Optimization 231(118)
4.1 Electromigration in Metallization Layers
231(17)
Ralph Spolenak, Horst Wendrdock, Klaus Wetzig
4.1.1 Fundamentals
231(3)
4.1.2 Methods for Quantitative Damage Analysis
234(3)
4.1.3 Al Interconnects
237(4)
4.1.4 Cu Interconnects
241(7)
4.2 Barrier and Nucleation Layers for Interconnects
248(13)
Ehrenfried Zschech
4.2.1 Introduction
248(1)
4.2.2 PVD Barrier Layers for Copper Interconnects
249(6)
4.2.3 Barrier/Seed Microstructure and Step Coverage
255(4)
4.2.4 New Barrier/Seed Concepts Using CVD and ALD
259(1)
4.2.5 Atomic Layer Deposition (ALD)
260(1)
4.3 Acoustomigration in Surface Acoustic Waves Structures
261(22)
Siegfried Menzel, Klaus Wetzig
4.3.1 General Remarks
261(1)
4.3.2 Acoustomigration Mechanism
262(1)
4.3.3 Metallization Concepts for Power SAW Structures
263(4)
4.3.4 Experimental Setup and SAW Technology
267(5)
4.3.5 Acoustomigration Experiments
272(11)
4.4 Thermal Stability of Magnetoresistive Layer Stacks
283(12)
Claus M. Schneider, Jürgen Thomas
4.4.1 Metallic Multilayers as GMR Model Systems
284(1)
4.4.2 Co/Cu Multilayers
285(8)
4.4.3 Ni80Fe20/Cu Multilayers
293(2)
4.5 Functional Magnetic Layers for Sensors and MRAMs
295(14)
Hartmut Vinzelberg, Dieter Elefant
4.5.1 Magnetic Multilayers: Layer Thickness Dependence of the GMR Parameters
296(5)
4.5.2 Spin Valves
301(4)
4.5.3 Magnetic Tunnel Junctions
305(4)
4.6 Multilayers for X-Ray Optical Purposes
309(14)
Hermann Mai, Stefan Braun
4.6.1 Multilayers as Reflectors for X-Rays
309(2)
4.6.2 Real Structure of nm-Multilayers
311(8)
4.6.3 High-Resolution Multilayers
319(3)
4.6.4 Multilayers with Uniform and Graded Period Thickness
322(1)
4.7 Functional Electric Layers
323(17)
Joachim Schumann, Jürgen Thomas
4.7.1 Resistance Layers
324(8)
4.7.2 Thermoelectric Thin Films
332(8)
4.8 References
340(9)
5 Devices 349(50)
5.1 Device Related Aspects for Si-Based Electronics
349(4)
Ehrenfried Zschech
5.1.1 Interconnect Technology and Materials Trends for Memory and Logic Products
349(1)
5.1.2 Copper Inlaid Process: Process Integration and Materials Related Topics
350(1)
5.1.3 Wiring Hierarchy for Copper/Low-k on-Chip Interconnects
351(2)
5.1.4 New Global Interconnect Concepts
353(1)
5.2 SAW High Frequency Filters, Resonators and Delay Lines
353(9)
Manfred Weihnacht
5.2.1 Introduction
353(1)
5.2.2 Transversal Filters
354(3)
5.2.3 Resonators
357(3)
5.2.4 Filters with Spread Spectrum
360(1)
5.2.5 Delay Lines
361(1)
5.3 Sensor Devices
362(11)
Christoph Treutler
5.3.1 Introduction
362(1)
5.3.2 Requirements for Thin Films to be Used as Transducers
362(1)
5.3.3 Thin Film Strain Gauges for Pressure Sensors and Force Meters
363(1)
5.3.4 Thin Film Thermometer in a Micromachined Air-Mass Flow Meter for Automotive Applications
364(2)
5.3.5 Magnetic Thin Films for Measuring Position, Angle, Rotational Speed and Torque
366(7)
5.4 X-Ray Optical Systems
373(10)
Hermann Mai, Stefan Braun
5.4.1 Basic Properties of the Combination of X-Ray Optical Elements
373(1)
5.4.2 X-Ray Astronomy
374(3)
5.4.3 X-Ray Microscopy
377(1)
5.4.4 Extreme Ultraviolet Lithography (EUVL)
378(2)
5.4.5 X-Ray Reflectometry and Diffractometry
380(1)
5.4.6 X-ray Fluorescence Analysis
381(2)
5.5 Thermoelectric Sensors and Transducers
383(11)
Joachim Schumann
5.5.1 Introduction
383(1)
5.5.2 Thermoelectric Energy Conversion — Some Basic Considerations
383(1)
5.5.3 Thermoelectric Sensors
384(6)
5.5.4 Thermoelectric Transducers
390(4)
5.5.5 Outlook
394(1)
5.6 References
394(5)
6 Outlook 399(6)
Klaus Wetzig, Claus M. Schneider
6.1 New Functionalities
399(1)
6.2 Materials-Related Aspects
400(1)
6.3 Microelectronics — Quo Vadis?
401(1)
6.4 What You See is What You Get
402(1)
6.5 References
403(2)
Index 405

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