Micro- And Opto-Electronic Materials And Structures

by Suhir, E.; Lee, Y. C.; Wong, C. P.

• ISBN13: 9780387279749
• ISBN10: 0387279741
• Format: Hardcover
• Copyright: 2007-08-30
• Publisher: Springer Verlag

Summary

The handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials, assemblies, structures and systems. Each chapter contains a summary of the state-of-the-art in a particular field and practical recommendations on how to apply current knowledge and technology to design, manufacture and operate a viable, reliable and cost-effective electronic component or photonic device, and on how to make such a device into a successful commercial product. The handbook can be used as a reference and as a manual for self-education. Designed and written for electrical, materials, mechanical, and reliability engineers, as well as applied physicists and materials scientists - this will be an essential reference for all those who are interested in the state-of-the-art of micro- and opto-electronic materials, packaging , and reliability, with an emphasis on physical design problems, challenges, and solutions.

Author Biography

Dr. Ephraim Suhir is Distinguished Member of Technical Staff (retired), Basic Research, Physical Sciences and Engineering Research Division, Bell Labs, Murray Hill, NJ. He is currently on the faculty of the Electrical Engineering Department, University of California, Santa Cruz, CA and the Department of Mechanical Engineering, University of Maryland, College Park, MD. Dr. Suhir is Fellow of the American Physical Society (APS), the Institute of Electrical and Electronics Engineers (IEEE), the American Society of Mechanical Engineers (ASME), and the Society of Plastics Engineers (SPE). He is co-founder (with Dr. Peter Engel) of the ASME Journal of Electronic Packaging and served as its Technical Editor for eight years (1993-2001).   He has received numerous distinguished service and professional awards, including 2004 ASME Worcester Read Warner Medal for outstanding contributions to the permanent literature of engineering; 2001 IMAPS John A. Wagnon Technical Achievement Award for outstanding contributions to the technical knowledge of the microelectronics, optoelectronics, and packaging industry; 2000 IEEE-CPMT Outstanding Sustained Technical Contribution Award for outstanding, sustained and continuing contributions to the technologies in fields encompassed by the CPMT Society; 2000 SPE International Engineering/Technology (Fred O. Conley) Award for outstanding pioneering and continuing contributions to plastics engineering; and 1999 ASME and Pi-Tau-Sigma Charles Russ Richards Memorial Award for outstanding contributions to mechanical engineering. Prof. C. P. Wong is a Regents' Professor and the Charles Smithgall Institute Endowed Chair at the School of Materials Science and Engineering at Georgia Institute of technology. After his doctoral study, he was awarded a two-year postdoctoral fellowship with Nobel Laureate Professor Henry Taube at Stanford University.  He joined AT&T Bell Laboratories in 1977 as a member of the technical staff and in 1992, he was elected as an AT&T Bell Laboratories Fellow for his fundamental contributions to low-cost high performance plastic packaging of semiconductors. Since 1996, he is a Professor at the School of Materials Science and Engineering at the Georgia Institute of Technology. He has received many awards, among those, the AT&T Bell Labs Fellow Award in 1992, the IEEE CPMT Society Outstanding and Best Paper Awards in 1990, 1991, 1994, 1996, 1998, 2002, the IEEE CPMT Society Outstanding Sustained Technical Contributions Award in 1995, the IEEE Third Millennium Medal in 2000, the IEEE EAB Education Award in 2001, the IEEE CPMT Society Exceptional Technical Contributions Award in 2002 and the IEEE Components, Packaging and Manufacturing Technology Field Award in 2006.  Dr. Wong is a Fellow of the IEEE, AIC, and AT&T Bell Labs, and was the technical vice president (1990 &1991), and the president of the IEEE-CPMT Society (1992 &1993). He was elected a member of the National Academy of Engineering in 2000. Professor Y. C. Lee is a Professor of Mechanical Engineering. He was the Chair of ASME Electronic and Photonic Packaging Division (EPPD) from 2004 to 2005. From 1993 to 2002, he was an Associate Director of the Center for Advanced Manufacturing and Packaging of Microwave, Optical and Digital Electronics, University of Colorado at Boulder. Prior to joining the University in 1989, he was a Member of Technical Staff at AT&T Bell Laboratories, Murray Hill, New Jersey.  Dr. Lee was an Associated Editor of ASME Journal of Electronic Packaging from 2001 to 2004 and a Guest Editor for IEEE Transaction on Advanced Packaging in 2003 and 2005. He has received several awards: ASME Fellow, December 2002, Presidential Young Investigator (National Science Foundation, 1990), Outstanding Young Manufacturing Engineer Award (SME, 1992), Outstanding Paper Award (IEEE-ECTC, 1991), Outstanding Paper Award (ASME J. of Electronic Packaging, 1993), IEEE Transactions on Advanced Packaging Honorable Mention Paper Award, 2003  

Table of Contents

Volume I: Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging

Materials Physics

Polymer materials characterization, modeling and application

Thermo-optic effects in polymer bragg gratings

Photorefractive materials and devices for passive components in WDM systems

Thin films for microelectronics and photonics: physics, mechanics, characterization, and reliability

Carbon nanotube based interconnect technology: opportunities and challenges

Virtual thermo-mechanical prototyping of microelectronics and Microsystems

Materials Mechanics

Fiber optics structural mechanics and nano-technology based new generation of fiber coatings: review and extension

Area array technology for high reliability applications

Metallurgical factors behind the reliability of high-density lead-free interconnections

Metallurgy, Processes and Reliability of Lead-Free Solder Interconnects fatigue life assessment for lead-free solder joints

Lead-free solder materials: design for reliability

Application of moire interferometry to strain analysis of PCB deformations at low temperatures

Characterization of stresses and strains in microelectronics and photonics devices using photomechanics methods

Analysis of reliability of IC packages using fracture mechanics approach

Dynamic response of micro-electronic systems to shocks and vibrations: review and extension

Dynamics of the physical reliability of photonic materials

High-speed tensile testing of optical fibers - new understanding for reliability prediction

The effect of temperature on the microstructure nonlinear dynamics behavior

Effect of Material's nonlinearity on the mechanical response of some piezo-electric and photonic systems

Volume II

Analytical thermal stress modeling in physical design for reliability of micro-and opto-electronic systems: role, attributes, challenges, results

Probabilistic physical design of fiber-optic structures

The wirebonded interconnect: a mainstay for electronics

Metallurgical interconnections for extreme high and low temperature environments

Design, processing and reliability of wafer level packages

Passive alignment of optical fibers in v-grooves with low viscosity epoxy

Reliability and Packaging

Fundamentals of reliability and stress testing

How to make a device into a product: accelerated life testing (ALT), its role, attributes, challenges, pitfalls, and interaction with qualification tests

Micro-deformation analysis and reliability estimation of micro-components by means of nanoDAC Technique

Reliability in mobile electronic products

MEMS packaging and reliability

Durability of optical nanostructures: laser diode structures and packages, a case study

Adhesives for micro-and opto-electronic applications: chemistry, reliability and mechanics

Multi-stages peel tests and evaluation of interfacial adhesion strength for micro- and opto- electronic materials

The effect of moisture on the adhesion and fracture of interfaces in microelectronic packaging

Highly compliant bonding material and structure for micro- and opto-electronic applications

Adhesive bonding of passive optical components

Electrically conductive adhesives: a research status review

Electrically conductive adhesives: structure dependence of the conductivity

Recent advances of conductive adhesives: a lead-free alternative in electronic packaging

Die attach quality testing by structure function evaluation

Mechanical behavior of flip chip packages under thermal loading

Stress analysis for processed silicon wafers and packaged micro-devices

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