Microfabrication for Microfluidics

Providing a definitive source of knowledge about the principles, materials, and process techniques used in the fabrication of microfluidics, this practical volume is a must for your reference shelf. The book focuses on fabrication, but also covers the basic purpose, benefits, and limitations of the fabricated structures as they are applied to microfluidic sensor and actuator functions. You find guidance on rapidly assessing options and tradeoffs for the selection of a fabrication method with clear tabulated process comparisons. To complement the book, a companion website will be periodically updated with the latest details on the subject, such as etch rates, mechanical properties, optical properties, and feature resolution for the different materials used in microfluidic devices.

Sang-Joon John Lee is an associate professor in the Department of Mechanical and Aerospace Engineering at San Jose State University (SJSU). He received a Ph.D. in mechanical engineering from the Massachusetts Institute of Technology, and conducted postdoctoral research in microscale engineering at Stanford University before joining SJSU.
Narayan Sundararajan is the chief technology officer at the Grameen-Intel joint venture at Intel Corporation. His prior experience includes managing a microfludics fabrication group and research initiatives in biomedical and life sciences at Intel. He received a Ph.D. from Cornell University.

Preface	p. xi
Introduction	p. 1
A Fabrication Perspective	p. 3
Scaling Laws and Fluid Phenomena	p. 5
Viscous Flow	p. 7
Surface Tension	p. 9
Diffusion	p. 10
Microfluidic Functions	p. 11
Flow Control	p. 12
Particle Manipulation	p. 12
Fluid Ejection	p. 13
Semantics	p. 13
Categorizing Fabrication Processes	p. 15
Bulk Micromachining Versus Surface Micromachining	p. 15
Serial Versus Parallel Fabrication Processes	p. 16
Major Fabrication Process Categories	p. 16
Organization of this Book	p. 17
References	p. 19
Geometric Features	p. 25
Common Types of Features	p. 28
Cavities and Orifices	p. 28
Microchannels	p. 30
Membranes	p. 34
Geometric Characteristics	p. 36
Profile	p. 36
Feature Resolution	p. 40
Aspect Ratio	p. 41
Degrees of Freedom	p. 41
Surface Roughness	p. 47
References	p. 50
Materials for Microfluidic Devices	p. 55
Types of Materials	p. 56
Polymers	p. 56
Silicon	p. 59
Glass	p. 61
Metals	p. 62
Other Materials	p. 63
Material Properties	p. 64
Mechanical Properties	p. 65
Thermal Properties	p. 69
Electrical Properties	p. 73
Optical Properties	p. 77
Magnetic Properties	p. 79
Other Physical Properties and Characteristics	p. 80
Chemical Resistance	p. 82
Surface Conditions	p. 83
References	p. 87
Photolithography	p. 99
Introduction	p. 99
Photoresist	p. 100
Photomasks	p. 100
Process Basics	p. 101
Coating	p. 102
Baking	p. 103
Alignment	p. 103
Exposure	p. 105
Developing	p. 108
References	p. 108
Solidification Processes and Soft Lithography	p. 111
Radiation-Selective Polymerization	p. 112
Ultraviolet Polymerization	p. 113
Alternative Radiation Sources	p. 114
Multilevel Features and 3D Profiles	p. 115
Casting and Molding	p. 122
Primary Casting	p. 124
Replica Molding	p. 126
Microinjection Molding	p. 128
Compression Molding	p. 129
Thermoplastic Reshaping	p. 129
Hot Embossing	p. 130
Nanoimprint Lithography	p. 131
Thermoforming	p. 132
Tabulated Examples of Solidification Processes	p. 132
References	p. 134
Subtractive Processes	p. 141
Wet Etching	p. 144
Isotropic Wet Etching	p. 145
Anisotropic Wet Etching	p. 147
Dry Etching	p. 150
Ion Etching	p. 152
Vapor Phase Etching	p. 153
Reactive Ion Etching	p. 154
Deep Reactive Ion Etching	p. 157
Directed Beam Subtractive Processes	p. 158
Laser Ablation	p. 159
Focused Ion Beam Milling	p. 161
Mechanical Subtractive Processes	p. 161
Precision Machining	p. 162
Abrasive Jet Milling	p. 162
Chemical-Mechanical Polishing	p. 163
Tabulated Examples of Subtractive Processes	p. 164
References	p. 166
Additive Processes	p. 173
Physical Vapor Deposition	p. 175
Evaporation	p. 178
Sputtering	p. 178
Pulsed Laser Deposition	p. 179
Oxidation	p. 179
Chemical Vapor Deposition	p. 180
Electroplating	p. 183
Printing and Coating Techniques	p. 186
Spin-on-Glass	p. 187
Screen Printing and Blade Leveling	p. 188
Micro Contact Printing	p. 188
Ink-Jet Printing and Direct-Write Material Deposition	p. 189
Dip-Pen Nanolithography	p. 190
Tabulated Examples of Additive Processes	p. 192
References	p. 193
Fugitive and Sacrificial Release Processes	p. 199
Reasons for Fugitive and Sacrificial Release Processes	p. 201
Approaches to Fugitive and Sacrificial Release Processes	p. 201
Examples of Approaches to Fugitive Processes	p. 202
Examples of Approaches to Sacrificial Release Processes	p. 206
Tabulated Examples of Fugitive and Sacrificial Release Processes	p. 209
References	p. 210
Substrate Bonding and Fluidic Interfacing	p. 213
Reasons for Substrate Bonding	p. 213
Process Issues and Selection Criteria for Substrate Bonding	p. 214
Approaches to Substrate Bonding	p. 216
Polymer Substrate Bonding	p. 217
Glass Substrate Bonding	p. 219
Silicon Substrate Bonding	p. 220
Other Substrate Materials and Bonding Methods	p. 221
Tabulated Examples of Bonding Processes	p. 222
Practical Issues and Selection Criteria for Fluidic Interfacing	p. 223
Approaches to Fluidic Interfacing	p. 226
References	p. 230
Functional Domains and System Integration	p. 237
Perspectives on Microfluidic Functionality	p. 237
Energy Transduction	p. 239
Electrokinetic Transduction and Electrical Measurements	p. 240
Electromechanical, Electromagnetic, and Electroacoustic Transduction	p. 241
Electrothermal, Thermopneumatic, and Thermomechanical Transduction	p. 241
Electrochemical and Chemomechanical Transduction	p. 242
Optical Interfacing	p. 243
Biological Interfacing	p. 244
Microfluidic System Integration	p. 244
References	p. 246
List of Acronyms and Abbreviations	p. 253
About the Authors	p. 257
Index	p. 259
Table of Contents provided by Ingram. All Rights Reserved.

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