Microvias : For Low Cost, High Density Interconnects

by Lau, John H.; Lee, S. W. Ricky.

• ISBN13: 9780071363273
• ISBN10: 0071363270
• Format: Hardcover
• Copyright: 2001-04-26
• Publisher: MCG

Summary

State-of-the-art introduction to high-density interconnect technology The first-ever book on this hot topic, Microvias: Low Cost, High Density Interconnects gives you a thorough look at the technology that’s changing the nature of printed circuit boards--and driving the mobile electronic revolution. A "must" for electronics and mechanical engineers, John Lau and Ricky Lee’s intensive introduction to microvia technology expertly covers all major techniques. You get important details on mechanical NC drilling, laser drilling, photo-defined, chemical and plasma etching, and conductive ink formation. You also get a survey of the work of leading companies and their products, including Canon, Compaq, Fujitsu Limited, Gore, Hitachi Chemical Co., Ibiden, IBM, JCI, JVC, K&S (X-Lam), Kyocera/JME, Matsushita, Mitsubishi, NEC, Samsung, Sheldahl, Shinko, Toshiba.

Author Biography

John H. Lau (Palo Alto, CA) is the President of Express Packaging Systems, Inc. He is the author of nine previous technical books and teaches throughout the world. Ricky S. Lee (Hong Kong, China) is a Professor of Electrical Engineering at the University of Hong Kong.

Table of Contents

Chapter 1: Introduction to Microvia and WLCSP Technologies.

Chapter 2: Conventional Printed Circuit Board Technologies.

Chapter 3: Microvias by Mechanical Drilling.

Chapter 4: Microvias by Laser Drilling.

Chapter 5: Microvias by Photoimaging.

Chapter 6: Microvias by Etching.

Chapter 7: Conductive Paste/Ink-Filled Microvias.

Chapter 8: Special High-Density Interconnects for Flip Chip Applications.

Chapter 9: Solders for Next-Generation High-Density Interconnects.

Chapter 10: Solder-Bumped Flip-Chip WLCSP.

Chapter 11: Assembly of Flip Chip on PCB/Substrate.

Chapter 12: Solder Joint Reliability of Flip Chip on Microvia PCB/Substrates.