Microwave Electronics Measurement and Materials Characterization

by Chen, L. F.; Ong, C. K.; Neo, C. P.; Varadan, V. V.; Varadan, Vijay K.

• ISBN13: 9780470844922
• ISBN10: 0470844922
• Edition: 1st
• Format: Hardcover
• Copyright: 2004-04-16
• Publisher: WILEY

Summary

The development of high speed, high frequency circuits and systems requires an understanding of the properties of materials functioning at the microwave level. This comprehensive reference sets out to address this requirement by providing guidance on the development of suitable measurement methodologies tailored for a variety of materials and application systems. Bringing together coverage of a broad range of techniques in one publication for the first time, this book: Provides a comprehensive introduction to microwave theory and microwave measurement techniques. Examines every aspect of microwave material properties, circuit design and applications. Presents materials property characterisation methods along with a discussion of the underlying theory. Outlines the importance of microwave absorbers in the reduction in noise levels in microwave circuits and their importance within defence industry applications. Relates each measurement technique to its application across the fields of microwave engineering, high-speed electronics, remote sensing and the physical sciences. This book will appeal to practising engineers and technicians working in the areas of RF, microwaves, communications, solid-state devices and radar. Senior students, researchers in microwave engineering and microelectronics and material scientists will also find this book a very useful reference.

Author Biography

L. F. Chen is the author of Microwave Electronics: Measurement and Materials Characterization, published by Wiley.

C. K. Ong is the author of Microwave Electronics: Measurement and Materials Characterization, published by Wiley.

C. P. Neo is the author of Microwave Electronics: Measurement and Materials Characterization, published by Wiley.

V. V. Varadan is the author of Microwave Electronics: Measurement and Materials Characterization, published by Wiley.

Vijay K. Varadan is the author of Microwave Electronics: Measurement and Materials Characterization, published by Wiley.

Table of Contents

Preface.

Acknowledgements.

1 Microelectromechanical Systems and RF MEMS.

1.1 Introduction.

1.2 MEMS.

1.4 Electromechanical Transducers.

1.5 Micro-sensing for MEMS.

1.6 Materials for MEMS.

1.7 Scope of this book.

2 MEMS Materials and Fabrication Techniques.

2.1 Metals.

2.2 Semiconductors.

2.3 Thin films for MEMS and their deposition techniques.

2.4 Materials for polymer MEMS.

2.5 Bulk Micromachining for Silicon based MEMS .

2.6 Silicon Surface Micromachining.

2.7 Microstereolithography for polymer MEMS.

2.8 Conclusions.

3. RF MEMS Micro relays and Switches.

3.1 Introduction.

3.2 Switch Parameters.

3.3 Basics of switching.

3.4 Switches for RF and microwave applications.

3.5 Actuation Mechanisms of RF MEMS switches.

3.6 Bistable relays and microactuators.

3.7 Dynamics of the Switch operation.

3.8 MEMS switch design, modeling and evaluation.

3.9 MEMS switch design considerations.

3.10 Conclusions.

4. MEMS Inductors and Capacitors.

4.1 Introduction.

4.2 MEMS/Micromachined Passive Elements: Pros and Cons.

4.3 MEMS Inductors.

4.4 MEMS Capacitors.

4.5 Conclusions.

5. Micromachined RF Filters.

5.1 Introduction.

5.2 Modeling of Mechanical Filters.

5.3 Micromechanical Filters.

5.5 Bulk Acoustic Wave Filters.

5.6 Micromachined Filters for mm wave Frequencies.

5.7 Summary.

6.  MEMS Phase Shifters.

6.1 Introduction.

6.2 Types of Phase shifters and their limitations.

6.3 MEMS Phase shifters.

6.4 Ferroelectric Phase shifters.

6.5 Applications.

6.6 Conclusions.

7. Micromachined Transmission lines and Components.

7.1 Introduction.

7.2 Micromachined transmission lines.

7.3 Design, fabrication and measurement.

7.4 Conclusions.

8 Micromachined Antennas.

8.1. Introduction.

8.2. Overview of Microstrip Antennas.

8.3. Micromachining Techniques to Improve Antenna Performance.

8.4. Micromachining as a Fabrication Process for Small Antennas.

8.5. Micromachined Reconfigurable Antennas.

8.6. Summary.

9. Integration and Packaging for RF MEMS Devices.

9.1 Introduction.

9.2 Role of MEMS packages.

9.3 Types of MEMS packages.

9.4 Flip chip Assembly .

9.5 Multichip module packaging.

9.6 RF MEMS packaging: Reliability issues.

9.7 Thermal Issues.

9.8 Conclusions.

Index.