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9780070235526

Multichip Modules and Related Technologies

by ;
  • ISBN13:

    9780070235526

  • ISBN10:

    007023552X

  • Format: Hardcover
  • Copyright: 1994-03-01
  • Publisher: McGraw-Hill

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Supplemental Materials

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Table of Contents

Foreword
Preface
Electronic Packaging Driving Forcesp. 1
General Multichip Module Considerationsp. 15
Basic Elements of Multichip Modulesp. 33
Bare-Die Termination Techniquesp. 51
Design Considerationsp. 87
Ceramic-Dielectric Multichip Modules (MCM-C)p. 111
Deposited-Dielectric Multichip Modules (MCM-D)p. 129
Laminated-Dielectric Multichip Modules (MCM-L)p. 167
Supplementary Interconnection Devicesp. 201
Thermal Design Considerationsp. 231
Multichip Module Applicationsp. 261
Indexp. 287
Table of Contents provided by Blackwell. All Rights Reserved.

Supplemental Materials

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