rent-now

Rent More, Save More! Use code: ECRENTAL

5% off 1 book, 7% off 2 books, 10% off 3+ books

9781439849590

Nano-CMOS Gate Dielectric Engineering

by ;
  • ISBN13:

    9781439849590

  • ISBN10:

    1439849595

  • Edition: 1st
  • Format: Hardcover
  • Copyright: 2011-11-28
  • Publisher: CRC Press

Note: Supplemental materials are not guaranteed with Rental or Used book purchases.

Purchase Benefits

  • Free Shipping Icon Free Shipping On Orders Over $35!
    Your order must be $35 or more to qualify for free economy shipping. Bulk sales, PO's, Marketplace items, eBooks and apparel do not qualify for this offer.
  • eCampus.com Logo Get Rewarded for Ordering Your Textbooks! Enroll Now
List Price: $130.00 Save up to $87.12
  • Rent Book $87.75
    Add to Cart Free Shipping Icon Free Shipping

    TERM
    PRICE
    DUE
    USUALLY SHIPS IN 3-5 BUSINESS DAYS
    *This item is part of an exclusive publisher rental program and requires an additional convenience fee. This fee will be reflected in the shopping cart.

How To: Textbook Rental

Looking to rent a book? Rent Nano-CMOS Gate Dielectric Engineering [ISBN: 9781439849590] for the semester, quarter, and short term or search our site for other textbooks by Wong; Hei. Renting a textbook can save you up to 90% from the cost of buying.

Summary

This book is a systematic review of high-K gate dielectric materials for CMOS chips (complementary metaloxide semiconductors), which are used in image sensors and data convertors (amplifiers, digital camera sensors, etc). Scaling CMOS devices down to the nanoscale creates new materials challenges, and one effective response is to introduce novel materials such as High K dielectrics. The book presents the fundamental physics and properties of High-K materials and how they can be fabricated and used in Nano CMOS devices.

Table of Contents

Forewordp. vii
Prefacep. xi
List of Abbreviationsp. xiii
Overview of CMOS Technologyp. 1
Introductionp. 1
MOS Transistor: A Quick Introduction to Classical Modelsp. 3
Current-Voltage Characteristicsp. 3
Threshold Voltagep. 6
Short-Channel Effects and Short-Channel Modificationsp. 9
Effect on I-V Characteristicsp. 10
Subthreshold Conductionp. 11
Short-Channel Effectsp. 13
Threshold Voltage Roll-Offp. 15
Drain-Induced Barrier Lowering (DIBL)p. 15
Gate Leakage Currentp. 17
Dkect-Tunnelingp. 18
Fowler-Nordheim Tunnelingp. 19
Poole-Frenkel Emission and Trap-Assisted Tunnelingp. 20
Features and Uniqueness of MOS Transistorp. 22
MOS in Deca-Nanometerp. 24
Technology Trends and Optionsp. 30
Technology Trendsp. 30
Technology Optionsp. 31
Device Structuresp. 32
Channel Engineeringp. 34
Source and Drain Engineeringp. 37
Gate Stack Engineeringp. 38
More than Moorep. 41
Summaryp. 43
Referencesp. 44
High-k Dielectricsp. 51
High-k Candidatesp. 51
Electronic Structure of Transition Metals and Rare Earth Metalsp. 54
Electronegativityp. 54
Bond Radiusp. 56
Material Properties of Elemental Transition Metal and Rare Metal Oxidesp. 57
Atomic and Electronic Structuresp. 57
Electronic Structure of Some High-k Oxidesp. 62
Electronic Structure of Aluminum Oxidep. 62
Electronic Structure of Crystalline Hafnium Oxidep. 64
Electronic Structure of Crystalline Zirconium Oxidep. 67
Electronic Structure of Rare Earth Metal Oxidesp. 68
Bandgap and Band Offset Energiesp. 74
Bond Ionicity and Dielectric Constantp. 77
Carrier Effective Massesp. 79
Thermal Stabilityp. 81
Crystallizationp. 81
Decomposition and Si Out-Diffusionp. 83
Disorders and Defectsp. 86
Intrinsic Oxygen Vacanciesp. 88
Oxygen Interstitialsp. 94
Grain Boundary Statesp. 96
Extrinsic Defectsp. 97
High-k/Si Interface Trapsp. 103
Summaryp. 104
Referencesp. 105
Complex Forms of High-k Oxidesp. 113
Introductionp. 113
Silicates and Alurninates Pseudo-Binary Alloysp. 114
Stoichiometric Binary Alloysp. 118
Dopingp. 120
Thermal Stability and Phase Separationp. 128
Summaryp. 130
Referencesp. 134
Dielectric Interfacesp. 139
Introductionp. 139
High-k/Sihcon Interfacep. 140
Interfacial Bondingp. 140
Bond Strain, Relaxation, and Phase Diagramsp. 148
Band Offsetsp. 152
High-k/Metal Interfacep. 154
Need of Metal Gatep. 154
Band Offset Energiesp. 156
Interface Stabilityp. 157
Summaryp. 161
Referencesp. 161
Impacts on Device Operationp. 167
Introductionp. 167
Gate Leakage Currentp. 167
Current Conduction Mechanismsp. 168
Parameters Governing the Charge Transportp. 171
Threshold Voltage Control and Fermi-Level Pinningp. 173
Channel Mobilityp. 180
Subthreshold Characteristicsp. 182
Dielectric Breakdownp. 186
Hot-Carrier Effectsp. 189
Temperature Instabilitiesp. 193
Summaryp. 196
Referencesp. 196
Fabrication Issuesp. 203
Process Integrationp. 203
Atomic Layer Depositionp. 207
Metal Organic Chemical Vapor Depositionp. 211
Physical Vapor Depositionp. 212
Etchingp. 213
Summaryp. 215
Referencesp. 215
Conclusionsp. 221
Fundamental Physical Constants and Unit Conversionsp. 225
Properties of Si and SiO2p. 227
Indexp. 229
Table of Contents provided by Ingram. All Rights Reserved.

Supplemental Materials

What is included with this book?

The New copy of this book will include any supplemental materials advertised. Please check the title of the book to determine if it should include any access cards, study guides, lab manuals, CDs, etc.

The Used, Rental and eBook copies of this book are not guaranteed to include any supplemental materials. Typically, only the book itself is included. This is true even if the title states it includes any access cards, study guides, lab manuals, CDs, etc.

Rewards Program