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Foreword | p. vii |
Preface | p. xi |
List of Abbreviations | p. xiii |
Overview of CMOS Technology | p. 1 |
Introduction | p. 1 |
MOS Transistor: A Quick Introduction to Classical Models | p. 3 |
Current-Voltage Characteristics | p. 3 |
Threshold Voltage | p. 6 |
Short-Channel Effects and Short-Channel Modifications | p. 9 |
Effect on I-V Characteristics | p. 10 |
Subthreshold Conduction | p. 11 |
Short-Channel Effects | p. 13 |
Threshold Voltage Roll-Off | p. 15 |
Drain-Induced Barrier Lowering (DIBL) | p. 15 |
Gate Leakage Current | p. 17 |
Dkect-Tunneling | p. 18 |
Fowler-Nordheim Tunneling | p. 19 |
Poole-Frenkel Emission and Trap-Assisted Tunneling | p. 20 |
Features and Uniqueness of MOS Transistor | p. 22 |
MOS in Deca-Nanometer | p. 24 |
Technology Trends and Options | p. 30 |
Technology Trends | p. 30 |
Technology Options | p. 31 |
Device Structures | p. 32 |
Channel Engineering | p. 34 |
Source and Drain Engineering | p. 37 |
Gate Stack Engineering | p. 38 |
More than Moore | p. 41 |
Summary | p. 43 |
References | p. 44 |
High-k Dielectrics | p. 51 |
High-k Candidates | p. 51 |
Electronic Structure of Transition Metals and Rare Earth Metals | p. 54 |
Electronegativity | p. 54 |
Bond Radius | p. 56 |
Material Properties of Elemental Transition Metal and Rare Metal Oxides | p. 57 |
Atomic and Electronic Structures | p. 57 |
Electronic Structure of Some High-k Oxides | p. 62 |
Electronic Structure of Aluminum Oxide | p. 62 |
Electronic Structure of Crystalline Hafnium Oxide | p. 64 |
Electronic Structure of Crystalline Zirconium Oxide | p. 67 |
Electronic Structure of Rare Earth Metal Oxides | p. 68 |
Bandgap and Band Offset Energies | p. 74 |
Bond Ionicity and Dielectric Constant | p. 77 |
Carrier Effective Masses | p. 79 |
Thermal Stability | p. 81 |
Crystallization | p. 81 |
Decomposition and Si Out-Diffusion | p. 83 |
Disorders and Defects | p. 86 |
Intrinsic Oxygen Vacancies | p. 88 |
Oxygen Interstitials | p. 94 |
Grain Boundary States | p. 96 |
Extrinsic Defects | p. 97 |
High-k/Si Interface Traps | p. 103 |
Summary | p. 104 |
References | p. 105 |
Complex Forms of High-k Oxides | p. 113 |
Introduction | p. 113 |
Silicates and Alurninates Pseudo-Binary Alloys | p. 114 |
Stoichiometric Binary Alloys | p. 118 |
Doping | p. 120 |
Thermal Stability and Phase Separation | p. 128 |
Summary | p. 130 |
References | p. 134 |
Dielectric Interfaces | p. 139 |
Introduction | p. 139 |
High-k/Sihcon Interface | p. 140 |
Interfacial Bonding | p. 140 |
Bond Strain, Relaxation, and Phase Diagrams | p. 148 |
Band Offsets | p. 152 |
High-k/Metal Interface | p. 154 |
Need of Metal Gate | p. 154 |
Band Offset Energies | p. 156 |
Interface Stability | p. 157 |
Summary | p. 161 |
References | p. 161 |
Impacts on Device Operation | p. 167 |
Introduction | p. 167 |
Gate Leakage Current | p. 167 |
Current Conduction Mechanisms | p. 168 |
Parameters Governing the Charge Transport | p. 171 |
Threshold Voltage Control and Fermi-Level Pinning | p. 173 |
Channel Mobility | p. 180 |
Subthreshold Characteristics | p. 182 |
Dielectric Breakdown | p. 186 |
Hot-Carrier Effects | p. 189 |
Temperature Instabilities | p. 193 |
Summary | p. 196 |
References | p. 196 |
Fabrication Issues | p. 203 |
Process Integration | p. 203 |
Atomic Layer Deposition | p. 207 |
Metal Organic Chemical Vapor Deposition | p. 211 |
Physical Vapor Deposition | p. 212 |
Etching | p. 213 |
Summary | p. 215 |
References | p. 215 |
Conclusions | p. 221 |
Fundamental Physical Constants and Unit Conversions | p. 225 |
Properties of Si and SiO2 | p. 227 |
Index | p. 229 |
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