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Preface | p. v |
The Evolution of Silicon Electronics | p. 1 |
Introduction | p. 1 |
The Early Days of Semiconductor Electronics | p. 2 |
Moore's Law | p. 7 |
Further trends and the ITRS | p. 12 |
Improved MOSFET Designs | p. 20 |
MOSFETs for High-Frequency Operation? | p. 27 |
MOSFET Theory | p. 35 |
Introduction | p. 35 |
Different MOSFET Versions | p. 37 |
Definitions of Threshold Voltage | p. 42 |
MOS Fundamentals | p. 44 |
Conventional Two-Terminal MOS Structure | p. 45 |
Single-Gate and Double-Gate SOI MOS Structures | p. 66 |
An Approximated Sheet Concentration Versus Gate Voltage Relationship | p. 82 |
MOSFET Current — Voltage Characteristics | p. 87 |
Introduction | p. 87 |
Classical MOSFET Model | p. 87 |
Two-Region MOSFET Model | p. 91 |
Modified Two-Region Model | p. 93 |
Effective Mobility | p. 95 |
Scattering Model | p. 97 |
Comparison and Assessment of the Four Transistor Models | p. 104 |
Subthreshold Current | p. 106 |
Series Resistances | p. 108 |
Short-Channel Effects | p. 108 |
The Concept of Scale Lengths | p. 117 |
Nanoscale MOSFETs | p. 129 |
MOSFET Scaling Theory | p. 129 |
Constant-Field and Constant-Voltage Scaling | p. 129 |
Generalized Scaling Approaches | p. 134 |
Good Technology Rules | p. 136 |
Nanoscale MOSFET Concepts — An Overview | p. 137 |
Nanoscale Bulk MOSFETs | p. 142 |
Basic Structure | p. 142 |
Doping Profiles | p. 143 |
Mobility Enhancement Techniques | p. 150 |
Strained Silicon | p. 150 |
Hybrid-Orientation Technology | p. 161 |
High-k Dielectrics and Metal Gates | p. 163 |
Nanoscale Single-Gate SOI MOSFETs | p. 172 |
Nanoscale Multiple-Gate MOSFETs | p. 181 |
Double-Gate MOSFETs | p. 181 |
Tri-Gate MOSFETs and Gate-All-Around MOSFETs | p. 188 |
Nanowire MOSFETs | p. 194 |
MOSFETs with Alternative Channel Materials | p. 196 |
The Effect of Multiple Technology Boosters | p. 204 |
MOSFETs for RF Applications | p. 219 |
Introduction | p. 219 |
RF Transistor Figures of Merit | p. 221 |
Gains | p. 221 |
The Characteristic Frequencies fT and fT | p. 225 |
Minimum Noise Figure and Associated Gain | p. 227 |
Output Power and Power-Added Efficiency | p. 228 |
Small-Signal Equivalent Circuits | p. 228 |
RF MOSFET Design and Performance | p. 234 |
RF Small-Signal MOSFETs | p. 234 |
RF Power MOSFETs | p. 244 |
Comparison of RF CMOS and Competing RF Transistor Technologies | p. 252 |
Why are Si MOSFETs so Fast? | p. 258 |
Overview of Nanometer CMOS Technology | p. 273 |
Introduction | p. 273 |
Lithography | p. 278 |
Introduction | p. 278 |
Optical Lithography | p. 279 |
Extremely Ultraviolet Lithography (EUV) | p. 285 |
Electron Beam Lithography (E-Beam) | p. 286 |
Imprint Lithography | p. 286 |
Plasma Etching | p. 288 |
Thin Film Formation Techniques | p. 291 |
Overview | p. 291 |
Chemical Vapor Deposition (CVD) | p. 293 |
Metal-Organic Chemical Vapor Deposition (MOCVD) | p. 294 |
Molecular Beam Epitaxy (MBE) | p. 294 |
Atomic Layer Deposition (ALD) | p. 295 |
Metal Film Deposition | p. 297 |
Junction Formation | p. 298 |
Ion Implantation | p. 299 |
Plasma Doping | p. 300 |
Interconnects | p. 302 |
Summary | p. 303 |
Outlook | p. 307 |
Introduction | p. 307 |
Critical Scaling Issues | p. 307 |
Issues Related to Device Physics | p. 307 |
Power Consumption and Self-Heating | p. 310 |
Interconnect Delays | p. 312 |
Will There be a Mainstream Beyond-Scaling, Post-CMOS Technology? | p. 314 |
Frequently Used Symbols | p. 323 |
Physical Constants and Unit Conversions | p. 327 |
Important Properties of Si and SiO2 | p. 329 |
Carrier Concentrations, Energy, and Potential | p. 331 |
Frequently Used Abbreviations | p. 335 |
Index | p. 337 |
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