Passive Micro-Optical Alignment Methods

by Boudreau; Robert A.

• ISBN13: 9780824707064
• ISBN10: 0824707060
• Format: Hardcover
• Copyright: 2005-06-22
• Publisher: CRC Press

Summary

The most expensive phase in the manufacture of micro-optical components and fiber optics is also one of the most performance-critical: optical alignment of the components. The increasing degree of miniaturization makes this an especially challenging task. Active alignment methods result in higher costs and awkward processes, and for some applications, they simply are not possible. Passive Micro-Optical Alignment Methods introduces the passive alignment methods that are currently available and illustrates them with many examples, references, and critiques. The first book dedicated to passive alignment, it begins with an overview of the current activities, requirements, and general results of passive optical alignments, followed by three sections of in-depth analysis. The first of these discusses mechanical passive alignment, highlighting silicon waferboard, solder, and "Jitney" technologies as well as application of mechanical alignment to 3D free-space interconnects. The next section describes the various visual alignment techniques applied to Planar Lightwave Circuits (PLCs) and low-cost plastic and surface mount packaging. The final section details various utilities that aid passive alignment and their resulting tradeoffs and demonstrates Monte Carlo analysis to evaluate the potential of a given method. Passive Micro-Optical Alignment Methods provides the tools necessary to meet the challenge of precision and low-cost alignment for applications that require micron or sub-micron tolerance.

Table of Contents

Overview
Overview of Passive Optical Alignment	1	(30)
Robert A. Boudreau
Sharon M. Boudreau
Karen Matthews
Definitions of Terms	1	(2)
Alignment of Arrays	3	(5)
Alignment of Transmitters and Receivers	8	(4)
Large-Spot Lasers	12	(2)
Micro-Optics	14	(1)
LIGA and High-Aspect Structures for Passive Alignment	15	(2)
The Suss Diebonder	17	(2)
Finetech's Fineplacer Lambda Bonder	19	(1)
Self-Alignment	20	(2)
Passive Alignment in PLCs	22	(1)
Miscellaneous Applications	23	(8)
References	25	(6)
SECTION 1 Mechanical Passive Alignment
Passive Alignment in Connectors and Splices	31	(24)
James Kevern
Alan Plotts
Introduction	31	(1)
Historical Perspective	32	(2)
Ferrule-Based Connectors	34	(13)
Single-Fiber Connectors	34	(1)
Cylinder in Bore Style Connectors	35	(4)
Tuning	39	(2)
Z-Axis Alignment	41	(2)
Splices	43	(1)
Array Connectors	44	(1)
Alignment by Planar Features	44	(2)
Alignment by Center of Features	46	(1)
Guide Pin/Hole Ferrules	46	(1)
Ferrule-Less Connectors	47	(2)
Back Plane Connectors	49	(2)
Conclusion	51	(4)
References	52	(3)
Mechanical Passive Alignment 1	55	(48)
Songsheng Tan
Hongtao Han
Robert A. Boudreau
Introduction	56	(1)
Advantages of Silicon Waferboard	56	(2)
Mechanical Passive Alignment	58	(1)
Wafer Fabrication	59	(23)
Silicon Isotropic Dry Etching	60	(1)
Plasma Etching	60	(3)
RIE Etching Chemistries	63	(1)
RIE Etched Silicon Structures for Passive Alignment	64	(2)
Passive Alignment Structures and Accuracy	66	(2)
Silicon Anisotropic Wet Etching	68	(1)
Etchants for Silicon Anisotropic Etching	69	(1)
EPW Solutions	69	(2)
Inorganic Aqueous Alkaline Solutions	71	(2)
TMAH Solutions	73	(1)
Crystallographic Orientation Effect	74	(3)
Etching Hillocks	77	(2)
Temperature Dependence of Etch Rates	79	(3)
Chip Notching for Silicon Waferboard Mounting	82	(1)
Process Controls	83	(1)
Die-Bonding Assembly	84	(3)
Wafer Scale Testing	87	(1)
Wafer Scale Burn In	88	(1)
Fiber Attach	89	(1)
Technology and Product Applications	90	(13)
Bidirectional Links	90	(2)
Surface Emitters and Detectors	92	(1)
High-Speed Packaging Design Using Silicon Waferboard	93	(2)
Connectorized Low-Cost Laser	95	(1)
References	96	(7)
Silicon Waferboard Mechanical Passive Alignment II	103	(46)
Werner Hunziker
Werner Vogt
Introduction	103	(1)
Optical Coupling of III-V Single-Mode Devices	104	(8)
Coupling Losses	105	(4)
Efficient Packaging of Single-Mode Devices	109	(3)
Principle of Si V-Groove Self-Alignment Technique	112	(9)
Optical Alignment	113	(5)
Electrical Connection	118	(3)
Applications of Si V-Groove Self-Alignment Technique	121	(20)
Space Switch Matrices	121	(4)
Laser Arrays	125	(6)
Tilted Amplifier Arrays	131	(5)
Chip-to-Chip Coupling	136	(3)
Device Packaging Using a Similar Alignment Principle	139	(2)
Summary	141	(8)
References	142	(7)
Soldering Technology for Optoelectronic Packaging	149	(31)
Qing Tan
Yung-Cheng Lee
Masataka Itoh
Introduction	149	(2)
Solder-Assembled Optoelectronic Modules	151	(8)
Solder Assembly with No Precision Self-Alignments	151	(3)
Self-Aligned Solder Assembly with No Mechanical Stops	154	(3)
Self-Aligned Solder Assembly with One Mechanical Stop	157	(1)
Self-Aligned Solder Assembly with Two Mechanical Stops	158	(1)
Case Study: AuSn Solder Flip-Chip Bonding and Its Module Applications	159	(9)
Bumping Technique	159	(2)
Stripe-Type Bump Bonding	161	(2)
Applications for Optical Module Si Benches	163	(1)
PD Array Module	163	(2)
LD Array Module	165	(1)
4 x 4 Optical Matrix Switch Module	166	(2)
Critical Issues	168	(11)
Solder Material and Deposition	169	(3)
Solder Reflow	172	(2)
Solder Design	174	(2)
Solder Reliability	176	(3)
Conclusions	179	(1)
Acknowledgments	180	(1)
References	180	(215)
Plastic-Based Passive Optical Alignment: The Jitney Parallel Optical Interconnect	187	(18)
Sharon M. Boudreau
Introduction	187	(1)
Components	188	(8)
Leadframe Module Package	188	(1)
Optical Coupler	189	(1)
Chips	190	(2)
Jitney Cable	192	(2)
Passive Alignment Considerations for Packaging	194	(1)
Alignment Studies	195	(1)
Testing	196	(3)
Component Testing	196	(1)
Laser Driver	196	(2)
OEIC Receiver	198	(1)
VCSEL	198	(1)
Module Characterization Testing	199	(1)
Jitney Testbeds	199	(4)
OETC Prototype Testbed	200	(1)
IBM AS/400 Testbed	201	(1)
Power Parallel Switch Testbed	201	(2)
Conclusion	203	(2)
References	203	(2)
Mechanical Methods for Free Space Passive Alignment	205	(36)
Nagesh Basavanhally
Introduction	205	(2)
Assembly Challenges	207	(14)
Alignment Tolerance	207	(4)
Component Mounts	211	(1)
Kinematic Design	211	(2)
Deflection Control	213	(3)
Fine Motion	216	(1)
Long-Term Stability	217	(4)
Mechanical ``Building Blocks'' for Micro-Passive Alignment	221	(4)
Silicon and Glass Substrates	221	(2)
Machined Ceramics	223	(1)
Optical Elements--Ball Lens and Glass Fiber	224	(1)
Precision Gage Pins and Blocks	224	(1)
Module Assembly	225	(5)
Optical Power Supply Module (Laser Pen)	226	(1)
Surface Active Device Assembly	227	(1)
Fiber Array Assembly	228	(1)
Microlens Array Assembly	229	(1)
Passive-Aligner Apparatus	230	(3)
Summary	233	(8)
Acknowledgments	234	(1)
References	235	(6)
SECTION 2 Visual Passive Alignment
Solder-Bump and Visual Passive Alignment Technologies for Optical Modules	241	(42)
Yasufumi Yamada
Tsuyoshi Hayashi
Yuji Akahori
Hideki Tsunetsugu
Kuniharu Katoh
Introduction	242	(1)
Comparison of Three Passive-Alignment Methods	243	(3)
Mechanical Contact Alignment	243	(1)
Solder-Bump Alignment Method	244	(1)
Index Alignment Method	245	(1)
Optical Modules Using Microsolder Bump Technique	246	(18)
Performance of Microsolder Bumps	246	(1)
Formation Technique and Mechanical Performance	246	(2)
Frequency Response	248	(4)
Optical Modules Using Ferrule-Integrated Platform	252	(3)
High-Speed Optical Modules Containing Solder-Bump-Bonded Hybrid Optoelectronic Integrated Circuits	255	(1)
Requirements for Packaging High-Speed Optical Devices	255	(1)
Application to Ultra-High-Speed Photoreceiver	256	(4)
Application to Wideband Optical 90-Hybrid Balanced Receiver	260	(4)
PLC Hybrid-Integrated Modules Using Index Alignment Technique	264	(14)
PLC Platform	264	(1)
Basic Structure and Fabrication Process of PLC Platform	264	(2)
Index Alignment for PLC Platform	266	(1)
Multichip Integration on PLC Platform	267	(1)
Applications of Multichip Integration on PLC Platform	268	(1)
Optical Wavelength Division Multiplexing Transceiver Module	268	(2)
External Cavity LD Module	270	(3)
High-Speed PLC Platform	273	(1)
Approach for High-Speed PLC Platform	273	(1)
Hybrid Integration Technologies for High-Speed Applications	273	(3)
10-Gbit/sec Hybrid Integrated Transmitter Using Solder Bump Technology	276	(2)
Concluding Remarks	278	(5)
References	278	(5)
Passive Alignment for Surface Mount Packaging and a Low-Cost Plastic Packaged Optical Module as an Application of the Passive Optical Alignment Method	283	(36)
Kazuhiko Kurata
Kimio Tatsuno
Passive Alignment for Surface Mount Packaging	284	(1)
Key Techniques	285	(11)
Visual Alignment	285	(4)
Fabrication Process of Silicon Substrate	289	(1)
Optical Coupling Design	290	(1)
Lens Design	291	(2)
Module Design	293	(2)
Advantage in Manufacturing	295	(1)
Advantage in Mounting on a Circuit Board	296	(1)
Application	296	(5)
SMT LD Module	297	(1)
PLC Module	298	(1)
PLC	299	(1)
PLC Module	299	(1)
LD-Fiber Coupling and Mounting on PLC	300	(1)
PD and LSI Mounting	301	(1)
Characteristics	301	(2)
High-Performance and Low-Cost Plastic Packaged Optical Module as an Application of the Passive Optical Alignment Method	303	(1)
Plastic Transmitter Module	304	(7)
Structure and Fabrication Process	304	(3)
Performances	307	(2)
Higher-Power Version	309	(2)
Plastic Packaging	311	(2)
Plastic Sealing	311	(1)
Thermal Resistance	312	(1)
Reliability	313	(1)
Conclusions	314	(5)
References	314	(5)
SECTION 3 Utilities for Passive Alignment
Large Spot Devices, Mode Transformers, and Optics	319	(30)
John V. Collins
Introduction	319	(3)
Large Spot Lasers	322	(7)
Modified Active Regions	322	(1)
Dilute Guides	322	(1)
Lateral Tapers	323	(6)
Vertical Tapers	329	(1)
Fabrication Techniques of Vertically Tapered Lasers	329	(3)
Etching	329	(1)
Growth	330	(2)
Combined Tapers	332	(1)
Separate Beam Expansion Regions	333	(4)
Passive Alignment	337	(1)
Precision Cleaving of Large Spot Lasers	337	(1)
Silicon Optical Bench	338	(1)
Laser Die Bonding	339	(1)
Temperature Performance	340	(1)
Coupling Results Using Large Spot Lasers	340	(2)
Wider Applications	342	(3)
Summary	345	(4)
References	345	(4)
Monte Carlo Analysis of Passive Alignment Methods	349	(46)
Randall B. Wilson
Overview and Introduction to Monte Carlo Analysis	351	(10)
The Monte Carlo Method	351	(1)
Manufacturing Flow Networks, Design Variables, and Yield	352	(5)
Passive Alignment, Optoelectronic Assembly, and Packaging	357	(1)
Passive vs. Active Alignment	358	(1)
Binning	359	(1)
Yield, Performance, and Cost Trade-Offs	360	(1)
Software Packages	361	(5)
@RISK and Crystal Ball	361	(2)
Mathematica	363	(1)
Spreadsheets	363	(1)
Programming Languages	363	(3)
Basic Method	366	(12)
Distributions and the Estimation of Parameters	367	(2)
Optical Coupling Models	369	(2)
Error Estimation	371	(3)
Correlation Effects	374	(1)
Origin of Correlation Effects	374	(1)
Introducing Correlation Effects into Monte Carlo Models	375	(1)
Yield and Correlated Output Variables	375	(1)
Analytical Solutions	376	(2)
Applications	378	(12)
Single-Mode Passive Alignment	378	(1)
Laser/Fiber	378	(7)
Fiber/Detector	385	(4)
Multimode Passive Alignment	389	(1)
Summary and Conclusions	390	(5)
Limitations of Monte Carlo Analysis	390	(1)
Extension to Other Problems for Future Research	391	(1)
Cost Modeling	391	(1)
Production Flow	391	(1)
Linking to Optimization Programs	391	(1)
DFB Lasers for ITU Grid Applications	391	(1)
DFB Lasers Characteristics	392	(1)
External Cavity Lasers	392	(1)
Monolithic Array Devices	392	(1)
References	392	(3)
Index	395