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Note: Supplemental materials are not guaranteed with Rental or Used book purchases.
Purchase Benefits
What is included with this book?
Create and deploy reliable polymeric materials for use in electronic products with this comprehensive guide
Modern electronic products are manufactured at a finer scale and with more precision than ever before. This places increasing demand on the proper use and management of high-performance polymers to create reliable, rapidly-operating semiconductor products. Understanding the physical properties and viscoelasticity analysis of resins is essential for engineers and researchers to perfect and deploy these polymers in electronics contexts.
Polymeric Materials for Electronic Packaging is designed to meet this specific need with a thorough introduction to these materials and their production. It provides the tools engineers need to reduce processing times and increase durability in their semiconductor packages and products. Translated from the Japanese original and offering in-depth analysis from a global-leading expert, this promises to be an indispensable volume.
Polymeric Materials for Electronic Packaging readers will also find:
Polymeric Materials for Electronic Packaging is critical for electrical and electronics engineers working with semiconductors, as well as advanced postgraduate students and researchers in this or numerous related areas.
Shozo Nakamura, PhD, is Professor Emeritus at the Hiroshima Institute of Techonology, Japan, and a sought-after corporate technical adviser. In 2019 he established the Nakamura Technical Research Institute.
Preface
Chapter 1 Basics of Semiconductor
1.1 Development of semiconductors
1.2 Analysis of semiconductor materials
Chapter 2 Basics of Polymer Materials
2.1 Polymer material
2.2 Types and classification of polymer materials
2.3 General properties of polymer materials
2.4 Summary
Chapter 3 Basic of elastic Theory
3.1 Elastic and elastic body
3.2 Stress and strain
3.3 Finite element analysis (FEM analysis)
3.4 Governing equation of elastic body
3.5 Law of elastic breakage
3.6 Plane stress and plane strain
Chapter 4 Stress evaluations of materials
4.1 Difference from strength of materials
4.2 Stress concentration and stress intensity factor
Chapter 5 Basics of Viscoelasticity
5.1 About viscosity
5.2 Elasticity and viscosity and viscoelasticity
5.3 Stress and strain response
5.4 Mechanical model representing viscoelastic properties
5.5 Conceptual formula for creep and stress relaxation
5.6 Master curve and time-temperature conversion Rule
5.7 Approximation of master curve
5.8 Superposition principle and basic equations
5.9 Principle of generation of thermal stress and Strain
Chapter 6 Measurement of viscoelastic properties
6.1 Dynamic viscoelasticity
6.2 Measurement method
6.3 Complex modulus and mechanical model
6.4 Dispersion and absorption by frequency
6.5 Actual measurement example
Chapter 7 Design issues of LSI packages
7.1 Introduction
7.2 Trends and issues of LSI packages
Chapter 8 Validity of viscoelastic VESAP analysis
8.1 Introduction
8.2 Structure of laminated body
8.3 Analysis method
8.4 Colling experiment of laminated body
8.5 Analysis results and experimental values
8.6 Conclusion
Chapter 9 Application to CSP-µBGA
9.1 Introduction
9.2 Structure and modeling of CSP-µBGA
9.3 Material property values used for analysis
9.4 Material and structure optimization by VESAP analysis
Chapter10 Thermal stress and warpage behavior during cooling process
10.1 Introduction
10.2 Structure of LSI package
10.3 Three-layer viscoelastic laminate model
10.4 Elucidation of warpage deformation behavior by VESAP analysis
Chapter 11 Warp deformation behavior from heating To cooling
11.1 Introduction
11.2 Two-layer laminate with epoxy resin / FR-4 Substrate
11.3 Three-layer laminate of metal / epoxy resin / FR-4 substrate
11.4 Analysis and experiment of four-layer laminate
Chapter12 Warp deformation prediction method considering curing shrinkage of resin
12.1 Introduction
12.2 Examination procedure and way of thinking
12.3 Contents of VESAP analysis
12.4 Simple prediction formula for calculating curing warpage
12.5 Warp deformation experiment
12.6 Theoretical prediction of warpage deformation due to hardening and heat
Chapter 13 Changes in material properties and warpage deformation behavior due to thermal degradation
13.1 Purpose and background
13.2 Experimental of case Ⅰ
13.3 Experimental of case Ⅱ
Chapter 14 Simple evaluation method for warp deformation of viscoelastic body
14.1 Introduction
14.2 Derivation of simple formula
14.3 Practical method
14.4 Determining the curing temperature of the resin
14.5 Effect of epoxy resin thickness on heat generation temperature
14.6 Conclusion
Chapter 15 Effect of cooling rate on warpage deformation of laminates
15.1 Warp deformation experiment
15.2 VESAP analysis
15.3 Final warp deformation amount and residual Warp deformation amount
15.4 Conclusion
Appendix
Development of viscoelastic analysis Software (VESAP)
1. Development needs and concepts
2. Derivation of basic formula
3. Contents of the developed VESAP software
Name index
Subject index
The New copy of this book will include any supplemental materials advertised. Please check the title of the book to determine if it should include any access cards, study guides, lab manuals, CDs, etc.
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