Preface & Acknowledgements | p. xvii |
Introduction to precision manufacturing | p. 1 |
Precision engineering | p. 1 |
Precision manufacturing | p. 2 |
Competitive drivers of precision manufacturing | p. 7 |
Historical developments in manufacturing | p. 9 |
Background | p. 9 |
Key drivers | p. 13 |
Historical examples | p. 16 |
Organization of this book | p. 33 |
Machine design for precision manufacturing | p. 37 |
Background on machine design for manufacturing | p. 37 |
Philosophy of precision machine design | p. 39 |
Sources of error - overview | p. 41 |
Principles of measurement | p. 49 |
Definition of terms - accuracy, repeatibility, and resolution | p. 49 |
Accuracy | p. 49 |
Repeatability (or precision) | p. 53 |
Resolution | p. 54 |
Probabilistic measure of accuracy | p. 55 |
Metrology and measurement | p. 57 |
Abbé's principle | p. 64 |
Metrology techniques | p. 67 |
Measurement of dimension and angle | p. 67 |
Measurement of form | p. 73 |
Straightness | p. 73 |
Flatness | p. 84 |
Roundness | p. 88 |
Other form errors | p. 99 |
Measurement of surface roughness | p. 99 |
Kinematic precision | p. 110 |
Subsurface damage | p. 112 |
Mechanical errors | p. 121 |
Introduction | p. 121 |
Errors due to machine elements (excluding bearings) | p. 123 |
Kinematic design | p. 128 |
Connectivity | p. 128 |
Kinematic elements | p. 129 |
Contact and complex support | p. 133 |
Summary of kinematic design | p. 142 |
Structural compliance | p. 143 |
Microscale compliance | p. 143 |
Macroscale compliance | p. 145 |
Bearings and spindles | p. 153 |
Bearings | p. 153 |
Aerostatic bearings and spindles | p. 163 |
Thermal errors | p. 167 |
Background on the thermal error problem | p. 167 |
Thermal effects in precision engineering | p. 171 |
Determining the effect of temperature other than 20°C | p. 180 |
Free and constrained bodies | p. 181 |
Effect of spatial temperature gradients | p. 184 |
Effect of temperature transients: soak-out time and sinusoidal response | p. 187 |
Conductive, convective, and radiative heat transfer parameters | p. 193 |
Specific heat sources and examples of thermal problems | p. 196 |
Environmental control of precision machinery | p. 202 |
Machine enclosures | p. 203 |
Factory and room enclosures | p. 204 |
Machine treatment without enclosures | p. 206 |
Thermal effects and metrology | p. 208 |
Observations | p. 215 |
Error mapping and error budgets | p. 217 |
Introduction | p. 217 |
Error mapping | p. 218 |
Error budget | p. 232 |
Definition of error budget | p. 232 |
Error budget flow chart | p. 233 |
Combinational rules for errors | p. 234 |
Error due to compliance and vibration | p. 239 |
Introduction | p. 239 |
Excitations in machine tools | p. 243 |
Weight deformation | p. 246 |
Cutting force deformation | p. 249 |
Type A deformation: Deformation due to the variation of the cutting force | p. 250 |
Introduction and background | p. 250 |
Examples for single edge cutting | p. 254 |
Machine stiffness and directional orientation | p. 256 |
Type B deformation: Deformation due to the variation of the stiffness along the tool path | p. 263 |
Comparison of the errors from deformation types A and B | p. 267 |
Forced vibrations | p. 272 |
Self-excited vibrations (chatter) | p. 273 |
Introduction | p. 273 |
Basic stability; effect of structural dynamics | p. 278 |
Variation of spindle speed and stability lobes | p. 288 |
Advanced analysis | p. 292 |
Sensors for precision manufacturing | p. 295 |
Introduction | p. 295 |
The relevance of precision manufacturing and the need for in-process monitoring and control | p. 295 |
Requirements for sensor technology for precision manufacturing | p. 297 |
Overview of sensors in manufacturing | p. 300 |
Introduction | p. 300 |
Sensor systems for process monitoring | p. 303 |
New developments in signal and information processing for tool condition monitoring | p. 308 |
Introduction | p. 308 |
Intelligent sensors | p. 311 |
Implementation strategies | p. 314 |
Multisensor approaches | p. 316 |
Sensors for high speed machining | p. 317 |
Acoustic emission in manufacturing | p. 320 |
Background | p. 320 |
Acoustic emission sources-diagnostics | p. 322 |
Acoustic emission sources-process monitoring | p. 323 |
Acoustic emission in machining | p. 325 |
Signal processing, feature extraction and sensor fusion | p. 334 |
Introduction | p. 334 |
Intelligent sensor defined | p. 337 |
Sensor fusion defined | p. 338 |
Fusion methodologies | p. 339 |
Neural networks | p. 341 |
Applications of signal processing and sensor fusion | p. 349 |
Introduction | p. 349 |
Tool wear detection using time series analysis of acoustic emission | p. 350 |
Time series analysis | p. 351 |
Experimental evaluation | p. 355 |
Sensor integration using neural networks for intelligent tool condition monitoring | p. 358 |
Use of multiple sensors | p. 360 |
Experimental evaluation | p. 363 |
The need for engineering models to design and predict the performance of in-process sensors | p. 369 |
Basic sensor classification and new sensing technologies | p. 372 |
Introduction | p. 372 |
Basic sensor types | p. 377 |
Mechanical sensors | p. 377 |
Thermal sensors | p. 380 |
Electrical sensors | p. 382 |
Magnetic sensors | p. 382 |
Radiant sensors | p. 383 |
Chemical sensors | p. 383 |
Applications of sensors in precision manufacturing | p. 384 |
AE-based monitoring of grinding wheel dressing | p. 384 |
Fast AE RMS analysis for wheel condition monitoring | p. 385 |
Grinding wheel topographical mapping | p. 387 |
Wheel wear mechanism | p. 389 |
AE-based monitoring of face milling | p. 390 |
AE-based monitoring of chemical mechanical planarization | p. 393 |
Monitoring of abrasive process parameters | p. 395 |
Precision scribing of CMP-treated wafers | p. 398 |
AE-based endpoint detection for CMP | p. 401 |
AE monitoring of surface chemical reactions for copper CMP | p. 403 |
AE characteristics of oxidation and dissolution in copper CMP | p. 411 |
Monitoring of precision scribing | p. 416 |
Monitoring of ultraprecision Turning of Single crystal copper | p. 418 |
Monitoring of ultraprecision turning of polycrystalline copper | p. 421 |
Summary | p. 422 |
Process planning for precision manufacturing | p. 425 |
Manufacturing system characteristics | p. 425 |
Process planning basics | p. 435 |
Process capability | p. 438 |
Background | p. 438 |
Process capability defined | p. 440 |
Cp as a planning metric | p. 444 |
Legacy-system integration for precision manufacturing | p. 451 |
Future integration for precision manufacturing process planning | p. 452 |
Precision machining processes | p. 455 |
Introduction | p. 455 |
Influence of machining parameters, work material, and tool geometry | p. 462 |
Influence of uncut chip thickness | p. 462 |
Machining brittle materials | p. 465 |
Effects of work material crystallography/directionality | p. 472 |
Process operating conditions | p. 478 |
Precision mfg. processes-diamond turning/milling | p. 482 |
Introduction | p. 482 |
Machine tool design | p. 484 |
Tool design and alignment | p. 491 |
Chip formation and process mechanics | p. 496 |
Abrasive processes - fixed and loose | p. 505 |
Fixed abrasive processes | p. 505 |
Material removal mechanisms | p. 505 |
Grinding forces, power and specific energy | p. 512 |
Grinding stiffness, contact stiffness and process time constant | p. 517 |
Nanogrinding | p. 520 |
Loose abrasive processes | p. 521 |
Polishing and lapping | p. 522 |
Chemical mechanical planarization (CMP) | p. 532 |
Process modeling in CMP | p. 540 |
Non-traditional processes | p. 551 |
Precision manufacturing applications and challenges | p. 555 |
Introduction | p. 555 |
Basic semiconductor device manufacturing | p. 559 |
Introduction | p. 559 |
So, what are they anyway and how are they made? | p. 561 |
Microfabrication: background and overview | p. 561 |
Lithography | p. 564 |
Applications of semiconductor manufacturing - MEMS | p. 570 |
Nanotechnology | p. 572 |
Background and definitions | p. 572 |
Nanostructured materials | p. 576 |
Nanofabrication techniques | p. 578 |
E-beam and nano-imprint Fabrication | p. 582 |
Epitaxy and strain engineering | p. 585 |
Quantum structure nanofabrication using epitaxy on patterned substrates | p. 585 |
Quantum structure nanofabrication using strain-induced self-assembly | p. 587 |
Scanned probe techniques | p. 589 |
Self-assembly | p. 595 |
MEMS and nanotechnology applications | p. 600 |
Nanotechnology applications | p. 601 |
Micro-machining and small scale defects | p. 604 |
Introduction | p. 604 |
Surface and edge finish | p. 607 |
Modeling | p. 611 |
Finite element modeling | p. 613 |
Molecular dynamics | p. 615 |
Multiscale modeling | p. 619 |
Mechanistic modeling | p. 620 |
Workpiece and design issues | p. 622 |
Micromolding | p. 622 |
Creation of micropattern and microstructure | p. 625 |
Creation of 3-dimensional shapes | p. 630 |
Ultrasonic vibration assisted micromachining | p. 631 |
Micro-tools | p. 633 |
Cutting fluid | p. 638 |
Metrology in micromachining | p. 640 |
Conclusion and outlook | p. 644 |
Burrs - preventing and minimizing burr formation in precision components | p. 646 |
Introduction and background | p. 647 |
Process-based solutions | p. 651 |
Milling | p. 652 |
Drilling | p. 654 |
Examples of application of burr minimization strategies | p. 657 |
Tool path planning in milling | p. 657 |
Burr control chart | p. 660 |
Integrated process planning and burr minimization | p. 661 |
Summary and conclusions | p. 662 |
Future of precision manufacturing | p. 665 |
Introduction | p. 665 |
The manufacturing pipeline | p. 666 |
Sustainable design/environmentally conscious design and manufacturing | p. 669 |
Technologies for sustainable manufacturing | p. 670 |
Green manufacturing pipeline | p. 671 |
Sustainable manufacturing or ""does green = sustainable?"" | p. 676 |
Manufacturing technology wedges | p. 678 |
Examples of wedge technology application areas for manufacturing | p. 680 |
Consumable use in machining | p. 681 |
Energy use in nanoscale manufacturing | p. 685 |
Environmentally conscious design of precision machines | p. 693 |
Sustainability budgets | p. 694 |
Constructing the sustainability budget | p. 696 |
Summary comments/conclusion | p. 701 |
References | p. 705 |
Index | p. 765 |
Table of Contents provided by Publisher. All Rights Reserved. |
The New copy of this book will include any supplemental materials advertised. Please check the title of the book to determine if it should include any access cards, study guides, lab manuals, CDs, etc.
The Used, Rental and eBook copies of this book are not guaranteed to include any supplemental materials. Typically, only the book itself is included. This is true even if the title states it includes any access cards, study guides, lab manuals, CDs, etc.