PVD for Microelectronics: Sputter Desposition to Semiconductor Manufacturing

by Rossnagel; Powell; Ulman

• ISBN13: 9780125330268
• ISBN10: 012533026X
• Format: Hardcover
• Copyright: 1998-10-23
• Publisher: Elsevier Science

Summary

GENERAL DESCRIPTION OF THE SERIESPhysics of Thin Films is one of the longest running continuing series in thin film science, consisting of 25 volumes since 1963. The series contains quality studies of the properties of various thin films materials and systems.In order to be able to reflect the development of today's science and to cover all modern aspects of thin films, the series, starting with Volume 20, has moved beyond the basic physics of thin films. It now addresses the most important aspects of both inorganic and organic thin films, in both their theoretical as well as technological aspects. Therefore, in order to reflect the modern technology-oriented problems, the title has been slightly modified from Physics of Thin Films to Thin Films.GENERAL DESCRIPTION OF THE VOLUMEThis volume, part of the Thin Films Series, has been wholly written by two authors instead of showcasing several edited manuscripts.

Table of Contents

Preface	ix	(4)
Useful Conversion Factors and Constants	xiii
Chapter 1 Introduction	1	(22)
1.1 The Role of PVD in Microelectronics	1	(11)
1.2 PVD and the Interconnect Roadmap	12	(5)
1.3 Additional Sources of Information on PVD	17	(3)
References	20	(3)
Chapter 2 Physics of Sputtering	23	(28)
2.1 Sputtering	23	(10)
2.2 Energy and Angular Distributions of Sputtered Atoms	33	(6)
2.3 Other Energetic Processes During Sputtering	39	(2)
2.4 Transport of Sputtered Atoms	41	(7)
References	48	(3)
Chapter 3 Plasma Systems	51	(36)
3.1 Diode Plasmas	53	(6)
3.2 Plasma Potential	59	(1)
3.3 Floating Potential	59	(1)
3.4 Flux to the Sheath	60	(1)
3.5 DC and RF Plasmas	61	(3)
3.6 RF Plasmas	64	(2)
3.7 RF Matchboxes	66	(1)
3.8 Magnetic Fields	67	(9)
3.9 Reactive Sputter Deposition	76	(5)
3.10 Practical Plasma Issues in PVD Tools	81	(2)
3.11 Plasma Diagnostics and Optical Emission Magnetrons	83	(2)
References	85	(2)
Chapter 4 The Planar Magnetron	87	(16)
4.1 The DC Magnetron	87	(1)
4.2 The Planar Magnetron	88	(3)
4.3 The Swept-Filed Magnetron	91	(4)
4.4 Source Arcing	95	(3)
4.5 Low Pressure Sputtering	98	(2)
References	100	(3)
Chapter 5 Sputtering Tools	103	(82)
5.1 Evolution of PVD Tools for Microelectronics	103	(12)
5.2 Generic PVD Cluster Tool	115	(3)
5.3 The Technology of PVD Cluster Tools	118	(53)
5.4 300 mm PVD	171	(3)
5.5 PVD Process Mapping	174	(2)
5.6 Cost-of-Ownership (CoO)	176	(5)
References	181	(4)
Chapter 6 Directional Deposition	185	(30)
6.1 Damascene Processing	187	(4)
6.2 Long Throw Deposition Techniques	191	(4)
6.3 Collimated Sputter Deposition	195	(17)
References	212	(3)
Chapter 7 Planarized PVD: Use of Elevated Temperature and/or High Pressure	215	(26)
7.1 Physics of Hot PVD	216	(4)
7.2 Elevated Temperature PVD Al	220	(11)
7.3 Elevated Temperature PVD Cu	231	(4)
7.4 Application of High Pressure	235	(3)
7.5 Conclusions	238	(1)
References	239	(2)
Chapter 8 Ionized Magnetron Sputter Deposition: I-PVD	241	(44)
8.1 Experimental Systems	241	(9)
8.2 Plasma Aspects	250	(10)
8.3 Deposition and Experimental Results	260	(1)
8.4 Lining Trenches and Vias	261	(7)
8.5 Trench and Via Filling	268	(10)
8.6 Electrical Measurements	278	(2)
8.7 Materials Properties	280	(3)
References	283	(2)
Chapter 9 PVD Materials and Processes	285	(68)
9.1 Introduction	285	(2)
9.2 Metrology	287	(5)
9.3 Al Alloys	292	(15)
9.4 Titanium	307	(6)
9.5 Titanium Nitride	313	(10)
9.6 Titanium-Tungsten (Ti-W) Alloys	323	(4)
9.7 Refractory Metal Silicides	327	(4)
9.8 Copper	331	(9)
9.9 PVD and CVD	340	(7)
9.10 Upper Lever Metallization	347	(2)
References	349	(4)
Chapter 10 Process Modeling for Magnetron Deposition	353	(22)
10.1 Cathode Surface Models	354	(2)
10.2 Transport Modeling	356	(3)
10.3 The Water Surface	359	(12)
10.4 Conclusion	371	(1)
References	372	(3)
Chapter 11 Sputtering Targets	375	(26)
11.1 Target Fabrication	376	(2)
11.2 Target Cooling	378	(5)
11.3 Target Burn-In	383	(1)
11.4 Target Composition	384	(3)
11.5 Target Purity	387	(2)
11.6 Target Utilization	389	(3)
11.7 Microstructural Engineering	392	(4)
11.8 Particle Generation	396	(3)
References	399	(2)
Index	401