Rf and Microwave Microelectronics Packaging

by Kuang, Ken; Kim, Franklin; Cahill, Sean S.

• ISBN13: 9781441909831
• ISBN10: 1441909834
• Format: Hardcover
• Copyright: 2009-11-01
• Publisher: Springer Verlag

Summary

RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.

Table of Contents

Fundamentals of Packaging at Microwave and Millimeter-Wave Frequencies	p. 1
Wavelength and Frequency	p. 3
Lumped Elements	p. 3
Transmission Lines	p. 5
Dispersion	p. 8
Dispersion Effects in High Speed Systems	p. 10
Transmission Line Distributed Effects	p. 12
Transmission Line Coupling and Cross Talk	p. 13
Package Fabrication Methods	p. 15
Co-fired Ceramics	p. 15
Thick Film and Thin Film Ceramics	p. 18
Organic Substrates	p. 19
Interconnects	p. 20
Conclusions	p. 22
References	p. 23
Low-Cost High-Bandwidth Millimeter Wave Leadframe Packages	p. 25
Introduction	p. 25
MicroCoax Approach	p. 26
Packaging Approaches	p. 29
Limitations to the Approach	p. 32
MicroCoax/Leadframe Approach	p. 32
Package I/O Structure Considerations	p. 33
Modelling the Signal Path	p. 34
Performance	p. 38
Conclusion	p. 42
Polymeric Microelectromechanical Millimeter Wave Systems	p. 43
Introduction	p. 43
Polymeric Millimeter Wave Systems using Micromachining Technologies	p. 44
Fabrication Examples of mm-Wave Components	p. 48
Polymeric Waveguides	p. 48
Waveguide-Based Iris Filters	p. 49
Waveguide-Based Tunable Filters and Phase Shifters	p. 51
Waveguide-Fed Horn Antennas	p. 55
W-Band Waveguide Feeding Network of a 2x2 Horn Antenna Array	p. 57
Fundamenial Characterizations of Polymer Metallization Process	p. 59
Surface Roughness	p. 59
Characterization of In-channel Electroplating Thickness	p. 61
Geometry Effects	p. 62
Conclusion	p. 65
References	p. 65
Millimeter-Wave Chip-on-Board Integration and Packaging	p. 69
Motivation for a Chip-on-Board Approach for Millimeter-Wave Product Manufacturing	p. 69
The Drive for Low Cost	p. 69
Low-Cost Manufacturing Processes	p. 70
Problems Specific to Millimeter-Wave Electronics	p. 73
A Chip-on-Board Solution	p. 80
The Surface-Mount Panel	p. 81
Attaching the Bare Chips	p. 83
Wire Bond Interconnects	p. 83
Eliminating Wire Bonds in the RF Path	p. 84
Cover Lamination	p. 85
Segregation	p. 87
Testing	p. 87
Application Examples	p. 87
A 60-GHz Transceiver	p. 88
Miniaturized 60-GHz Transmitter and Receiver Modules	p. 89
76-Glh Automotive Radar Module Package	p. 89
Summary	p. 90
References	p. 90
Liquid Crystal Polymer for RF and Millimeter-Wave Multi-Layer Hermetic Packages and Modules	p. 91
Introduction	p. 91
Design and Fabrication of the Thin-Film LCP Package	p. 93
Lid Construction and Lamination	p. 97
Results and Model of Lowpass Feedthrough	p. 98
Hermeticity and Leak Rate Measurement	p. 101
Reliability of LCP Surface Mount Packages	p. 102
Non-operating Temperature Step Stressing	p. 103
Non-operating Thermal Shock Testing	p. 103
Operating Humidity Exposure Testing	p. 105
Reliability Testing Summary	p. 106
Bandpass Feedthrough	p. 106
Bandpass Feedthrough Design and Fabrication	p. 106
Bandpass Feedthrough Results and Discussion	p. 109
Conclusion	p. 111
References	p. 112
RF/Micrownve Substrate Packaging Roadmap for Portable Devices	p. 115
Introduction	p. 115
Substrate Materials for Portable Products	p. 116
RF Substrate Materials Thermal and Electrical Properties	p. 116
Standard FR-4	p. 116
High TG FR-4	p. 117
Polyimide	p. 118
Cyanate Ester Blend (BT- Bismaleamiden Triazine)	p. 118
PTFE Based Laminates	p. 119
PTFE Resin Coated on Conventional Glass	p. 119
PTFE Film Impregnated with Cyanate Ester or Epoxy Resin	p. 119
PTFE Mixed with Low Dk Ceramic	p. 119
Materials Summary	p. 120
Substrate Critical Properties	p. 120
Dielectric Constant (Dk)	p. 120
Dissipation Factor/Dielectric Loss: (tan ¿)	p. 121
Glass Transition Temperature (Tg)	p. 121
Glass Decomposition Temperature; Td	p. 121
Moisture Absorption	p. 122
Coefficient of Thermal Expansion	p. 122
Materials Summary	p. 122
Portable Products Technology Roadmap	p. 122
Summary	p. 126
Summary	p. 128
References	p. 128
Ceramic Systems in Package for RF and Microwave	p. 129
Introduction	p. 129
Rf-Platform	p. 129
LTCC for Systems in Package	p. 130
Design of Ceramic Packages	p. 131
Why Multi-Project Wafers Made of LTCC?	p. 131
Hermetic Capping of MEMS with Ceramic Lids	p. 132
LTCC Packages for Advanced RF and Microwave Applications	p. 133
Three Examples	p. 135
4 by 4 Patch Antenna Array for Operation at 35 GHz	p. 135
LTCC for 77-81 GHz Automotive Radar Systems-in-Package	p. 142
24 GHz Switched Beam Steering Array Antenna Based on RF MEMS Switch Matrix	p. 145
RF-MEMS for Radar and Telecom Applications	p. 155
Research Activities and Trends on RF-MEMS Switches	p. 156
References	p. 163
Low-Temperature Cofired-Ceramic Laminate Waveguides for mm Wave Applications	p. 165
Introduction	p. 165
The Laminated Waveguide	p. 166
Transitions to a LWG	p. 167
Rectangular Waveguide Theory	p. 169
LTCC Process	p. 174
Insertion Loss in an LTCC Laminated Waveguides	p. 174
U-band	p. 177
V-band	p. 178
E-band	p. 178
W-band	p. 178
F-band	p. 184
LWG-to-LWG Coupling	p. 184
LWG vs. Stripline	p. 184
Summary	p. 187
References	p. 188
LTCC Substrates for RF/MW Application	p. 189
Introduction	p. 189
LTCC Fabrication Process	p. 192
Current Status and Trend	p. 197
References	p. 203
High Thermal Dissipation Ceramics and Composite Materials for Microelectronic Packaging	p. 207
Introduction	p. 208
Ceramics and Carbon Based Materials	p. 210
Common Packaging Ceramics	p. 210
LTCC	p. 210
High Performance Packaging Ceramics (BeO AIN)	p. 215
Direct Bond Copper (DBC) Packaging	p. 218
RF/MW Brazed Packages	p. 220
Thin-Film Packaging	p. 221
Thick-Film Packaging	p. 221
Carbon Nanotubes (CNT)	p. 223
Composites	p. 223
Metal Matrix Composites	p. 223
Cu/cBN Composites	p. 227
Cu/SiC Composites	p. 228
Al/Diamond Composites	p. 228
Conclusions	p. 231
References	p. 231
High Performance Microelectronics Packaging Heat Sink Materials	p. 233
Introduction	p. 233
Refractory Metal Based Microelectronics Packaging Materials	p. 236
Development, Manufacturing and Application of Copper Tungsten	p. 236
Development, Manufacturing and Application of Copper Molybdenum (MoCu)	p. 241
Development, Manufacturing and Application of Copper-Molybdenum-Copper Laminates and Copper-Copper/Molybdenum-Copper Laminates	p. 244
Aluminum Based Heat Sink Materials	p. 248
AlSiC Heat Sink Materials	p. 248
New Development for Microelectronics Packaging Heat Sink Materials	p. 258
References	p. 261
Technology Research on AIN 3D MCM	p. 267
Introduction	p. 267
Experiment	p. 269
Co-fired Spacer Rod and 2D MCM Substrate	p. 269
Vertical Interconnected by BGA Solder Ball	p. 269
A1N 3D MCM Package	p. 269
Technological Method	p. 270
Result and Discussion	p. 270
General Technological Scheme	p. 270
Layout and Interconnect Design	p. 271
Matching Optimization Research on W paste and A1N Ceramics	p. 272
Technological Improvement Experiment of AIN 2D MCM Substrate	p. 273
The Making of Spacer Rod	p. 274
Package Technology	p. 276
Vertical Interconnected Technology Research	p. 276
Result of Experiment	p. 278
Conclusion	p. 278
References	p. 278
Index	p. 281
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