Foreword | p. vii |
Preface | p. ix |
Acknowledgments | p. xiii |
Introduction | p. 1 |
Packaging Challenges | p. 13 |
Printed Wiring Board Technology | p. 23 |
Component Technologies: First Level Packaging | p. 65 |
Interconnect Technologies: Second-Level Packaging | p. 133 |
Printed Wiring Boards Assembly | p. 181 |
Essentials of Reliability Statistics | p. 211 |
Reliability of Electronic Assemblies | p. 239 |
Failures and Prevention | p. 284 |
Future Trends in Portable Electronic Products | p. 371 |
Standards and Specifications | p. 411 |
Acronyms and Abbreviations | p. 413 |
Selected Source Books in Electronic Packaging | p. 419 |
Index | p. 421 |
About the Authors | p. 437 |
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