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In semiconductor-device fabrication processes, lithography technology is used to print circuit patterns on semiconductor wafers. The remarkable miniaturization of semiconductor devices has been made possible only because of the continuous progress in lithography technology. However, for the trend of ever-increasing miniaturization to continue, a breakthrough in lithography technology is now needed. This book describes advanced techniques under development that represent the key to future semiconductor-device fabrication. To help the reader understand the background to developments in lithography technology, trends in ULSI technology and future prospects are reviewed, and the requirements that future lithography technology must meet are described. Several important lithography methods, such as deep UV lithography, x-ray lithography, electron-beam lithography, and focused ion-beam lithography are described in detail by experts in each area. Other relevant technologies, such as those that concern resist materials, metrology, and defect inspection and repair are also described.

List of contributors

vii

Preface

xi

Acknowledgements

xiii

List of principal abbreviations

xiv

Introduction

1

(9)

Masao Fukuma

Device technology trends

1

(6)

Demands for lithography

7

(2)

Conclusion

9

(1)

References

9

(1)

Optical lithography

10

(56)

Kunihiko Kasama

Shinji Okazaki

Hisatake Sano

Wataru Wakamiya

Introduction

10

(1)

History

11

(4)

Principles

15

(2)

i-line lithography

17

(5)

Deep-UV lithography

22

(18)

Resolution-enhancement technologies

40

(10)

Mask/reticle technology

50

(13)

References

63

(3)

X-ray lithography

66

(41)

Kimiyoshi Deguchi

Teruo Hosokawa

Sunao Ishihara

Katsumi Suzuki

Principles

66

(2)

X-ray source

68

(13)

X-ray mask

81

(7)

X-ray mask alignment technology

88

(8)

X-ray lithography processes and device fabrication

96

(8)

Summary

104

(1)

References

105

(2)

Electron-beam lithography

107

(89)

Takayuki Abe

Koichi Moriizumi

Yukinori Ochiai

Norio Saitou

Tadahiro Takigawa

Akio Yamada

Direct writing

107

(51)

Mask writing

158

(14)

Data conversion

172

(8)

Proximity effect correction

180

(11)

Summary

191

(1)

References

192

(4)

Ion-beam lithography

196

(17)

Masanori Komuro

Shinji Matsui

Principles

196

(2)

Focused-ion-beam lithography

198

(8)

Masked-ion-beam lithography

206

(4)

Summary

210

(1)

References

211

(2)

Resists

213

(65)

Hiroshi Ban

Tadayoshi Kokubo

Makoto Nakase

Takeshi Ohfuji

Principles

213

(12)

Resists for i-line lithography

225

(9)

Resists for deep-UV lithography

234

(18)

Resists for electron-beam and X-ray lithography

252

(12)

Advanced resist process technology

264

(8)

Summary

272

(1)

References

273

(5)

Metrology, defect inspection, and repair

278

(43)

Tadahito Matsuda

Toru Tojo

Seiichi Yabumoto

Introduction

278

(1)

Metrology

278

(13)

Inspection

291

(17)

Repair

308

(9)

Summary

317

(1)

References

318

(3)

Index

321

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