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Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments book cover, ISBN 9781003247005

Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments

by Juan Cepeda-Rizo; Jeremiah Gayle; Joshua Ravich

ISBN13: 9781003247005
ISBN10: 1003247008
eBook ISBN(s): 9781000511086
Format: Nonspecific Binding
Copyright: 2021-12-29
Publisher: Taylor & Francis

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1. Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments > ISBN13: 9781003247005

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