Thin Films

by Corcoran, Sean G.; Joo, Young-Chang; Moody, Neville R.; Suo, Zhigang

• ISBN13: 9781558997332
• ISBN10: 1558997334
• Format: Hardcover
• Copyright: 2004-06-30
• Publisher: Materials Research Society

Summary

Understanding the mechanical behavior of thin films is crucial for a wide variety of technologies. This behavior can critically influence the design, performance and reliability of thin-film structures used in every area of thin-film technology. However, the performance of these devices is often limited by the mechanical properties of both the films and the structures to which they are attached. The concepts, models and techniques developed for bulk materials often do not apply to small dimensions, and the mechanisms controlling behavior are not well defined. This book brings together an international group of researchers and students from industry, academia and national laboratories to address the mechanical behavior of thin films. Of particular interest are those studies that cut across length scales such as atomistic-to-nanometer or nanometer-to-submicron scale. Topics include: stress evolution; modeling stresses and film instability; deformation and adhesion; film fracture and fatigue; processing and structure; indentation testing; mechanical properties; properties and performance; and multilayers and nanolaminates.

Table of Contents

Preface	xvii
Materials Research Society Symposium Proceedings	xviii
STRESS EVOLUTION
Mechanical Strain Evolution in Cu/low K Interconnect Lines	3	(6)
Paul R. Besser and Qing-Ting Jiang
Irreversible Tensile Stress Development in PECVD Silicon Nitride Films	9	(6)
Michael P. Hughey and Robert F. Cook
X-ray Microbeam Diffraction Measurements in Polycrystalline Aluminum and Copper Thin Films	15	(6)
L.E. Moyer, G.S. Cargill III, W. Yang, B.C. Larson, and G.E. Ice
Use of the Curvature Method to Determine the Misfit Stress of Epitaxial Semiconducting Systems: The Case of Samples Thinned for TEM Observation	21	(8)
A. Ponchet, M. Cabié, L. Durand, M. Rivoal, and A. Rocher
MODELING STRESSES AND FILM INSTABILITY
Dislocation Image Stresses at Free Surfaces by the Finite Element Method	29	(6)
Meijie Tang, Guanshui Xu, Wei Cai, and Vasily Bulatov
Phase Field Modeling of Surface Instabilities Induced by Stresses	35	(6)
D.J. Seol, S.Y. Hu, Z.K. Liu, S.G. Kim, W.T. Kim, K.H. Oh, and L.Q. Chen
An Atomistic View of Interface-Mediated Dislocation Plasticity in Thin Metal Films	41	(6)
E.S. Ege and Y.-L. Shen
Dislocation Dynamics in Semiconductor Thin Film-Substrate Systems	47	(8)
E.H. Tan and L.Z. Sun
DEFORMATION AND ADHESION
Fracture in Thin Oxide Films	55	(8)
D.F. Bahr, A.L. Olson, K.R. Morasch, M.S. Kennedy, D. Rodriguez Marek, and A. Alamr
Measurement of Residual Stress in ZnO Thin Films Deposited on Silicon Wafers by the Indentation Fracture Test	63	(6)
Tong-Yi Zhang and Bin Huang
Thin Film Herringbone Buckling Patterns	69	(6)
Xi Chen and John W. Hutchinson
The Effect of Oxygen on Adhesion of Thin Copper Films to Silicon Nitride	75	(6)
Mengzhi Pang, Monika Backhaus-Ricoult, and Shefford P. Baker
Fracture Patterns in Thin Films and Multilayers	81	(6)
Alex A. Volinsky, Dirk C. Meyer, Tilmann Leisegang, and Peter Paufler
The Thermal Annealing Effect on the Residual Stress and Interface Adhesion in the Compressive Stressed DLC Film	87	(6)
Heon Woong Choi, Myoung-Woon Moon, Tae-Young Kim, Kwang-Ryeol Lee, and Kyu Hwan Oh
Subcritical Delamination of Dielectric and Metal Films From Low-k Organosilicate Glass (OSG) Thin Films in Buffered pH Solutions	93	(6)
Y. Lin, J.J. Vlassak, T.Y. Tsui, and A.J. McKerrow
Bonding Characterization of Oxidized PDMS Thin Films	99	(6)
J.J. McMahon, Y. Kwon, J.-Q. Lu, T.S. Cale, and R.J. Gutmann
Effects of Process Parameters on the Adhesion of Copper Film on Polyethylene Tetrephthalate(Pet) Substrate Prepared by ECRMOCVD Coupled with a Periodic DC Bias	105	(6)
Jin Hyun, Bup Ju Jeon, Dongjin Byun, and Joong Kee Lee
Adhesion Strength of Polymer Coatings Studied by Laser Induced Delamination	111	(8)
A. Fedorov, A. van Veen, R. van Tijum, and J.Th.M. de Hosson
FILM FRACTURE AND FATIGUE
Toughness and Contact Behavior of Conventional and Low-k Dielectric Thin Films	119	(12)
Robert F. Cook, Dylan J. Mon-is, and Jeremy Thurn
Understanding Adhesion Failure in Low-k Dielectric Stack During Chemical-Mechanical Polishing	131	(6)
F. Iacopi, D. Degryse, I. Vos, M. Patz, and K. Maex
Solutions and Discussions of Thin Film Undergoing the Nonlinear Peeling	137	(6)
Yueguang Wei, Siqi Shu, and Ying Du
Effects of Varying Mean Stress and Stress Amplitude on the Fatigue of Polysilicon	143	(10)
H. Kahn, R. Ballarini, and A.H. Heuer
Fracture Behavior of Micro-Sized Specimens Prepared From a TiAl Thin Foil	153	(6)
K. Takashima, T.P. Halford, D. Rudinal, Y. Higo, and P. Bowen
A Membrane Deflection Fracture Experiment to Investigate Fracture Toughness of Freestanding MEMS Materials	159	(8)
H.D. Espinosa and B. Peng
Microstructural Aspects of Fracture in Nanolayered TiAlCrN Thin Films	167	(6)
A.E. Santana, A. Karimi, V.H. Derflinger, and A. Schütze
Resistance to Cracking of a Stretchable Semiconductor: Speed of Crack Propagation for Varying Energy Release Rate	173	(8)
Sheng Liu, Hee C. Lim, Min Qu, John F. Federici, Gordon A. Thomas, Helena Gleskova, and Sigurd Wagner
PROCESSING AND STRUCTURE
Effect of Dielectric Materials on Stress-Induced Damage Modes in Damascene Cu Lines	181	(6)
Jong-Min Paik, Hyun Park, Ki-Chul Park, and Young-Chang Joo
Young's Modulus Variation with Thickness of Thin Films	187	(6)
L.G. Zhou and Hanchen Huang
Stretchable Conductors: Thin Gold Films on Silicone Elastomer	193	(6)
Stephanie P. Lacour, Sigurd Wagner, and Z. Suo
Stress-Assisted Copper-Induced Lateral Growth of Polycrystalline Germanium	199	(6)
B. Hekmatshoar, D. Shahrjerdi, S. Mohajerzadeh, A. Khakifirooz, M. Robertson, and A. Afzali-Kusha
Stress Relaxation During Isothermal Annealing at Elevated Temperatures in Electroplated Cu Films	205	(6)
Soo-Jung Hwang, Young-Chang Joo, and Junichi Koike
Stress and Texture in Sputter Deposited Cr Films	211	(6)
S. Yu. Grachev, J.-D. Kamminga, and G.C.A.M. Janssen
Thickness Dependent Stress Relaxation With the Onset of L10 Ordering in FePt Thin Films	217	(6)
K.W. Wierman, C.L. Platt, and J.K. Howard
Single-Crystal and Nano-Columnar Growth of Gadolinium-Doped Ceria Thin Films on Oxide Substrates Studied Using Electron Microscopy	223	(6)
D.X. Huang, C.L. Chen, and A.J Jacobson
Strain Control in SrRuO3 Thin Films by Using a Lattice Constant Tunable Buffer	229	(6)
K. Terai, T. Ohnishi, M. Lippmaa, H. Koinuma, and M. Kawasaki
Thermal Stability and Internal Stress for Strongly (111) Oriented Cu Films	235	(6)
Sinji Takayama, Makato Oikawa, and Tokuji Himuro
Stress and Defect Generation in Si Epitaxy	241	(6)
Tien Wang and Douglas Carlson
Interdiffusion in Coherent Si0.90Ge0.10/Si0.95Ge0.05 Superlattices	247	(6)
D.B. Aubertine and P.C. McIntyre
In Situ Investigation of Growth of Gold on Crystalline TiO2 and Amorphous Al2O3 Substrates	253	(4)
L. Lauter and R. Abermann
Formability of Ultra-Thin Plasma-Polymer Films Deposited on Metal Sheet: Mesoscopic and Nanoscopic Aspects of Defect Formation	257	(6)
B. Baumert, M. Stratmann, and M. Rohwerder
Investigation of Mechanical Properties of Mesoporous Methyl-Substituted SiO2 Thin Films (Methylsilesquioxane Materials)	263	(6)
M. Verdier, M. Montagnat, S. Maitrejean, and G. Passemard
In Situ, Real-Time Curvature Imaging During Chemical Vapor Deposition	269	(6)
David A. Boyd, Ashok B. Tripathi, Mohamed El-Naggar, and David G. Goodwin
Microstructure Evolution of On-Substrate NiTi Shape Memory Alloy Thin Films	275	(6)
Xi Wang, Ann Lai, Joost J. Vlassak, and Yves Bellouard
Guided Formation of Nanostructures in Thin Films	281	(8)
Wei Lu and Dongchoul Kim
INDENTATION TESTING
Probing Strain Fields About Thin Film Structures Using X-ray Microdiffraction	289	(6)
C.E. Murray, LC. Noyan, P.M. Mooney, B. Lai, and Z. Cai
Effects of the Substrate on the Determination of Hardness of Thin Films by the Nanoscratch and Nanoindentation Techniques: A Comparative Study for the Cases of Soft Film on Hard Substrate and Hard Film on Soft Substrate	295	(6)
Noureddine Tayebi, Andreas A. Polycarpou, and Thomas F. Conry
Dislocation Nucleation and Segregation in Nano-Scale Contact of Stepped Surfaces	301	(6)
H.H. Yu, P. Shrotriya, J. Wang, and K.-S. Kim
Determination of Residual-Stress-Free State and Mapping of Residual Stress Fields Using Speckle Interferometry and Thermal Relaxation	307	(6)
Dong-Won Kim, Jong-jin Kim, Dongil Son, Nak-Kyu Lee, Kyung-Hoan Na, and Dongil Kwon
Cracking and Phase Transformation in Silicon During Nanoindentation	313	(6)
Jae-il Jang, Songqing Wen, M.J. Lance, I.M. Anderson, and G.M. Pharr
Mechanisms Controlling the Hardness of Si and Ge	319	(6)
L.J. Vandeperre, F. Giuliani, S.J. Lloyd, and W.J. Clegg
Computational and Experimental Characterization of Indentation Creep	325	(6)
Ming Dao, Hidenari Takagi, Masami Fujiwara, and Masahisa Otsuka
Nanoindentation Behavior of Gold Single Crystals	331	(8)
Martha M. McCann and Sean G. Corcoran
Indentation Curve Analysis for Pile-Up, Sink-In and Tip-Blunting Effects in Sharp Indentations	339	(6)
Yeol Choi, Baik-Woo Lee, Ho-Seung Lee, and Dongil Kwon
Determining Stress-Strain Curves for Thin Films by Experimental/Computational Nanoindentation	345	(6)
Baik-Woo Lee, Yeol Choi, Yun-Hee Lee, Ju-Young Kim, and Dongil Kwon
A Theoretical Study on the Indentation of Viscoelastic Materials	351	(4)
Guanghui Fu
Effects of Thickness and Indenter Geometry in Nanoindentation of Nickel Thin Films	355	(8)
Padma Parakala, Reza A. Mirshams, Seifollah Nasrazadani, and Kun Lian
MECHANICAL PROPERTIES
Determination of Mechanical Parameters for Rotating MEMS Structures as a Function of Deposition Method	363	(6)
S. Soare, S.J. Bull, A. Oila, A.G. O'Neill, N. Wright, A. Horsfall, and J. dos Santos
Direct Observations of Grain Boundary Phenomena During Indentation of Al and Al-Mg Thin Films	369	(6)
W.A. Soer, J.Th.M. De Hosson, A.M. Minor, E.A. Stach, and J.W. Morris Jr.
Experimental Measurements of Surface Residual Stress Caused by Nano-Scale Contact of Rough Surfaces	375	(6)
J. Wang, P. Shrotriya, H.H. Yu, and K.-S. Kim
Mechanical Properties and Morphology of Polycrystalline 3C-SiC Films Deposited on Si and SiO2 by LPCVD	381	(6)
Xiao-an Fu, Jeremy Dunning, Srihari Rajgopal, and Ming Zhang
Thermo-Mechanical Behavior of Fe Thin Films	387	(6)
Nail R. Chamsoutdinov, Amarante J. Bottger, Rob Delhez, and Frans D. Tichelaar
Thermomechanical Behavior of Tantalum Thin Films: The Effects of Oxygen and the /t-a Phase Transformation	393	(6)
Robert Knepper, Blake Stevens, and Shefford P. Baker
Temperature Dependence of Biaxial Modulus and Thermal Expansion Coefficient of Thin Films Using Wafer Curvature Method	399	(6)
M. Capanu, A. Cervin-Lawry, A. Patel, I. Koutsaroff, P. Woo, Lynda Wu, J. Oh, J. Obeng, and B. McClelland
Measurement of Thin-Film Stress, Stiffness, and Strength Using an Enhanced Membrane Pressure-Bulge Technique	405	(6)
Aaron J. Chalekian, Roxann L. Engelstad, and Edward G. Lovell
Thermal-Mechanical Evaluation of Plated Electro-Magnetic NiFe for MEMS Generators	411	(6)
Yibin Xue, Keithan Hillman, and David Veazie
The Effects of Passivation Layer and Film Thickness on the Mechanical Behavior of Freestanding Electroplated Cu Thin Films With Constant Microstructure	417	(6)
Yong Xiang, Joost J. Vlassak, Maria T. Perez-Prado, Ting Y. Tsui, and Andrew J. McKerrow
Monotonic Testing and Tension-Tension Fatigue Testing of Free-Standing Al Microtensile Beams	423	(6)
Nicholas Barbosa III, Paul El-Deiry, and Richard P. Vinci
Effect of Monazite Coating on Tensile Properties of Nextel 720 Fibers, Tows and Minicomposites	429	(8)
Devdas M. Pai, Sergey Yarmolenko, Jagannathan Sankar, Balasubramanian Kailasshankar, Christopher Murphy, Edwardo Freeman, and Larry P. Zawada
PROPERTIES AND PERFORMANCE
Bulge Test on Free Standing Gold Thin Films	437	(6)
Yawen Li and Michael J. Cima
Microstructure-Mechanical Properties Relationship of Laser Interference Irradiated Ni/Al Multi-Film	443	(6)
C. Daniel, A. Lasagni, and F. Mucklich
Early Yielding and Stress Recovery in (111) and (100) Texture Components in Cu Thin Films Determined Using Synchrotron X-ray Diffraction	449	(6)
D.E. Nowak and S.P. Baker
Indentation and Finite Element Modeling Investigations of the Indentation Size Effect in Aluminium Coatings on Borosilicate Glass Substrates	455	(6)
I. Spary, N.M. Jennett, and A.J. Bushby
Young's Modulus, Poisson's Ratio, and Nanoscale Deformation Fields of MEMS Materials	461	(6)
I. Chasiotis, S.W. Cho, T.A. Friedmann, and J.P. Sullivan
Hinge Sensitivity in a Micro-Rotating Structure for Predicting Induced Thermo Mechanical Stress in Integrated Circuit Metal Interconnects	467	(6)
J.M.M. dos Santos, K. Wang, S.M. Soare, S.J. Bull, A.B. Horsfall, N.G. Wright, A.G. O'Neill, J.G. Terry, A.J. Walton, A.M. Gundlach, and J.T.M. Stevenson
Modeling and Optimal Design of Multilayer Cantilever Microactu ators	473	(6)
L.H. Han and T.J. Lu
Evaluation on Stress and Optical Property of Thin Films Used in Optical MEMS Device	479	(6)
Lianchao Sun and Ping Hou
Internal Oxidation and Mechanical Properties of Pt-IrO2 Thin Films	485	(6)
Richard R. Chromik, Thirumalesh Bannuru, and Richard P. Vinci
Scratch Test Measurements on CrNX Coatings	491	(6)
R. Hoy, P. van Essen, J.-D. Kamminga, G.C.A.M. Janssen, and A.P. Ehiasarian
Tuning the Mechanical Properties of SiO2 Thin Film for MEMS Application	497	(6)
Wang-Shen Su, Weileun Fang, and Ming-Shih Tsai
Optimization of Film Stresses Utilized in Composite Piezoelectric Membrane Microgenerators	503	(6)
M.S. Kennedy, M. Zosel, C.D. Richards, R.F. Richards, D.F. Bahr, K.W. Hipps, and N.R. Moody
Stress and Strength of Free-Standing 2-Dimensional Tetrahedral Amorphous Carbon Bridge Arrays	509	(6)
Daniel H.C. Chua, T.H. Tsai, W.I. Milne, D. Sheeja, and B.K. Tay
Residual Stress in Silicon Nitride Thin Films Deposited by ECR-PECVD	515	(6)
E. Cianci and V. Foglietti
A Study on Selective Etching of SiGe Layers in SiGe/Si Systems for Device Applications	521	(6)
Takashi Yamazaki, Tomohide Sekikawa, Shinya Morita, Yoshitaka Hakamada, Hiroyuki Ohri, Shun-ichiro Ohmi, and Tetsushi Sakai
Thin Film Material Parameters Derived From Full Field Nanometric Displacement Measurements in Non-Uniform MEMS Geometries	527	(6)
Jaime F. Cardenas-Garcia, Sungwoo Cho, and Ioannis Chasiotis
Characterizing Thin-Film Stress Fields by Resonance of Membrane Arrays	533	(8)
R. Engelstad, E. Lovell, A. Chalekian, S. Janowski, M. Cash, and H. Eguchi
MULTILAYERS AND NANOLAMINATES
Stress-Field in Sputtered Mo Thin Films and Mo/Ni Superlattices: Origin and Evolution After Ion-Irradiation	541	(6)
A. Debelle, G. Abadias, A. Michel, C. Jaouen, Ph. Guerin, and M. Drouet
Asymmetry in Multilayer Adhesion: the Zinc Oxide/Silver Interface	547	(6)
E. Barthel, P. Nael, O. Kerjan, and N. Nadaud
Design Maps for the Tensile Yield Strength of Nanoscale Metallic Multilayers	553	(6)
Adrienne V. Lamm and Peter M. Anderson
DLC/Hydroxyapatite Nanocomposites	559	(6)
Roger J. Narayan
Investigation of Structural and Mechanical Properties of UV and Microwave-Irradiated Al2O3/ZrO2 Multilayers by Sol-Gel Coating	565	(6)
A.R. Phani and H. Haefke
Microstructure and Current Transport Properties of YBa2Cu3O7-X/(Ba0.05, Sr0.95)TiO3 Multiple-Layer Thin Films	571	(6)
Y. Luo, R.A. Hughes, J.S. Preston, and G.A. Botton
Author Index	577	(4)
Subject Index	581