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9781558999275

Enabling Technologies for 3-d Integration

by
  • ISBN13:

    9781558999275

  • ISBN10:

    1558999272

  • Format: Hardcover
  • Copyright: 2009-06-15
  • Publisher: Materials Research Society
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Summary

An emerging technology or devices architecture called 3D IC integration is based on the system performance gains that can be achieved by stacking and vartically interconnecting distinct device chips The 3D concept of replacing long 2D interconnects with shorter vertical (3D) interconnect has the potential to alleviate the well-known interconnect.

Table of Contents

Recent advances in 3-D integration at IMECp. 3
High density direct bond interconnect (DBI) technology for three-dimensional integrated circuit applicationsp. 13
3-D integration latest developments at LETIp. 25
Current and future three-dimensional LSI integration technology by "chip on chip," "chip on wafer," and "wafer on wafer"p. 35
Exploration of the scaling limits of 3-D integrationp. 49
Modeling and simulation of parasitic effects in stacked siliconp. 61
Thermo-mechanical reliability of 3-D-integrated microstructures in stacked siliconp. 67
Current status of LSI micro-fabrication and future prospect for 3-D system integrationp. 79
Design and fabrication of 3-D microprocessorsp. 91
Three-dimensional integration of silicon chips for automotive applicationsp. 103
3-D integration technology for high performance detector arraysp. 115
Silicon through-hole interconnection for 3-D SiP using room temperature bondingp. 125
Active Si interposer : combination of through-Si vias and redistributionp. 133
CMOS-compatible through silicon vias for 3-D process integrationp. 145
Development of 3-D packaging process technology for stacked memory chipsp. 155
Through wafer interconnects for 3-D packagingp. 163
Fabrication and evaluation of 3-D packages with through hole viap. 171
Multi-stacked flip chips with copper plated through silicon vias and re-distribution for 3-D system-in-package integrationp. 179
Silicon layer stacking enabled by wafer bondingp. 193
Damascene-patterned metal-adhesive (Cu-BCB) redistribution layersp. 205
Vertical integration : a confederacy of alignment, bonding, and materials technologiesp. 215
Low temperature copper-nanorod bonding for 3-D integrationp. 225
3-D process integration - wafer-to-wafer and chip-to-wafer bondingp. 231
High-performance temporary adhesives for wafer bonding applicationsp. 239
Through-silicon-via copper deposition for vertical chip integrationp. 253
Materials aspects to consider in the fabrication of through-silicon viasp. 261
Grinding and mixed silicon copper CMP of stacked patterned wafers for 3-D integrationp. 275
Novel wafer dicing and chip thinning technologies realizing high chip strengthp. 281
Table of Contents provided by Blackwell. All Rights Reserved.

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