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9783527320349

Handbook of 3D Integration: Technology and Applications of 3D Integrated Circuits

by ; ;
  • ISBN13:

    9783527320349

  • ISBN10:

    3527320342

  • Format: Hardcover
  • Copyright: 2008-10-01
  • Publisher: Wiley-VCH
  • Purchase Benefits
List Price: $330.00

Summary

The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the requirements for further electronics developments and market necessities. This two-volume handbook presents 3D solutions to the feature density problem, addressing all important issues, such as wafer processing, die bonding, packaging technology, and thermal aspects.It begins with an introductory part, which defines necessary goals, existing issues and relates 3D integration to the semiconductor roadmap of the industry, before going on to cover processing technology and 3D structure fabrication strategies in detail. This is followed by fields of application and a look at the future of 3D integration.The contributions come from key players in the field, from both academia and industry, including such companies as Lincoln Labs, Fraunhofer, RPI, ASET, IMEC, CEA-LETI, IBM, and Renesas.

Author Biography

Dr. Philip Garrou is a consultant in the field of thin film microelectronic materials and applications, prior to which he was Director of Technology and New Business Development for Dow Chemicals' Advanced Electronic Materials business. He has authored two microelectronics texts and is co-author of over 75 peer reviewed publications and book chapters.

Dr. Christopher A. Bower is Senior Research Scientist at Semprius Inc., Durham, NC, where he works on the heterogeneous integration of compound semiconductors with silicon integrated cirucits. He previously held positions at Inplane Photonics as a senior process development engineer and as a scientist at RTI International, where he served as the technical lead on multiple DARPA-funded 3D integration programs. Dr. Bower has authored or co-authored over 40 peer-reviewed publications and holds 2 U.S. patents.


Dr. Peter Ramm is head of the silicon technology department of the Fraunhofer Institute for Reliability and Microintegration (IZM) in Munich, Germany, where he is responsible for process integration of innovative devices and new materials. He received his Ph.D. in physics from the University of Regensburg and subsequently worked for Siemens before joining the Fraunhofer Institute for Solid State Technology (IFT) in Munich in 1988. He is the author or co-author of more than 50 papers and 20 patents.

Table of Contents

Preface
List of Contributors.
Introduction to 3D Integration
Drivers for 3D Integration
Overview of 3D Integration Process Technology
Through Silicon Via Fabrication
Deep Reactive Ion Etching of Through Silicon Vias
Laser Ablation
SiO 2
Insulation - Organic Dielectrics
Copper Plating
Metallization by Chemical Vapor Deposition of W and Cu
Wafer Thinning and Bonding Technology
Fabrication, Processing and Singulation of Thin Wafers
Overview of Bonding Technologies for 3D Integration
Chip-to-Wafer and Wafer-to-Wafer Integration Schemes
Polymer Adhesive Bonding Technology
Bonding with Intermetallic Compounds
Integration Processes
Commercial Activity
Wafer-Level 3D System Integration
Interconnect Process at the University of Arkansas
Vertical Interconnection by ASET
3D Integration at CEA-LETI
Lincoln Laboratory's 3D Circuit Integration Technology
3D Integration Technologies at IMEC
Fabrication Using Copper Thermo-Compression Bonding at MIT
Rensselaer 3D Integration Processes
3D Integration at Tezzaron Semiconductor Corporation
3D Integration at Ziptronix, Inc.
3D Integration ZyCube
Design , Performance, and thermal Management
Design for 3D Integration at North Carolina State University
Modeling Approaches and Design Methods for 3D System Design
Multiproject Circuit Design and Layout in Lincoln Laboratory's 3D Technology
Computer-Aided Design for 3D Circuits at the University of Minnesota
Electrical Performance of 3D Circuits
Testing of 3D Circuits
Thermal Management of Vertically Integrated Packages
3D and Microprocessors
3D Memories
3D Read-Out Integrated Circuits for Advanced Sensor Arrays
Power Devices
Wireless Sensor Systems - The e-CUBES Project
Table of Contents provided by Publisher. All Rights Reserved.

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