We're sorry, but eCampus.com doesn't work properly without JavaScript.
Either your device does not support JavaScript or you do not have JavaScript enabled.
How to enable JavaScript in your browser.
Need help? Call 1-855-252-4222
by Pulickel M. Ajayan (Rensselaer Polytechnic Institute, Troy, NY, USA); Linda S. Schadler (Rensselaer Polytechnic Institute, Troy, NY, USA); Paul V. Braun (University of Illinois, Urbana, IL, USA); et al.
by Frank J. Fabozzi (School of Management, Yale University, USA); Sergio M. Focardi; Petter N. Kolm
by Editor: Gretchen M. Spreitzer (University of Michigan, USA); Editor: Kimberly Hopkins Perttula (University of Southern California, USA)
by Sen M. Kuo (Northern Illinois University, USA); Bob H. Lee (Ingenient Technologies Inc., USA); Wenshun Tian (UTStarcom Inc., USA)
by Editor: Bernard Spolsky (Formerly Bar Ilan University, Israel ); Editor: Francis M. Hult (University of Texas at San Antonio, USA )
by Editor: Badi Baltagi (Texas A & M University, USA )
by John M. Opitz (University of Utah, USA); Giovanni Neri (Univ. Cattolica, Rome, Italy); Susan O. Lewin (University of Utah, USA)
by Frank J. Landy (Baruch College, City University, New York ); Jeff M. Conte (San Diego State University, USA )
by Editor: Y. H. Hui (Consultant to the food industry, West Sacremento, USA); Associate Editor: Jó; zsef Barta (Corvinus University of Budapest); et al.
by Editor: Savio Woo (University of Pittsburgh, USA); Editor: Per Renströ; m (Karolinska Institute, Stockholm, Sweden); et al.